Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Engineering services specializing in ESD detection, prevention, program management, and training. Extensive experience in environmental monitoring and control, along with machine lock-up. Lab services include ESD & material testing.
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Electronics Forum | Fri Jul 17 05:09:10 EDT 2020 | sara_pcb
I have identified one equipment "MALCOM SWB2 " What is the approx budget required
Electronics Forum | Fri Jul 17 04:18:54 EDT 2020 | sara_pcb
I am looking for test setup for accessing through hole & surface mount soldeability of PCB. Who are the suppliers of wetting balance type test setup
Used SMT Equipment | In-Circuit Testers
Agilent N4416A Balanced Measurement S-parameter Test Set, 300 kHz to 6 GHz The Agilent N4416A S-parameter test set is a key component of an Agilent physical layer and balanced-measurement system. When combined with an Agilent PNA Series E8356A,
Used SMT Equipment | In-Circuit Testers
Agilent N4416A Balanced Measurement S-parameter Test Set, 300 kHz to 6 GHz The Agilent N4416A S-parameter test set is a key component of an Agilent physical layer and balanced-measurement system. When combined with an Agilent PNA Series E8356A,
Industry News | 2013-07-22 09:54:27.0
GPD Global has introduced its new NCM5000 dispense pump for easy jetting. With only two wetted parts and no seals or springs to replace or adjust, field operation is simple.
Industry News | 2003-03-31 09:43:08.0
With Schedectady International to develop, manufacture, and sell waterborne photoimagable etch resists and soldermasks in North America.
Parts & Supplies | SMT Equipment
Steel clamp cylinder (P4374/010031) Product Name: P4374; 1010031MPM steel clamp cylinder Part Number: P4374; 1010031 Description: P4374; 1010031; MPM stencil clamping cylinder; MPM SCREEN CLAMP CYLINDER Applicable models: UP; AP Printin
Parts & Supplies | SMT Equipment
Vacuum channel opening and closing cylinder Name: P1928; vacuum channel opening and closing cylinder Part Number: P1928 Description: P1928 vacuum pump channel opening and closing cylinder Applicable models: UP; AP Printing Presses P1
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2023-01-10 20:03:37.0
Since the IPC-4552 rev A for ENIG was introduced there have been many requests for clarification of acceptable and unacceptable levels of nickel corrosion. This paper attempts to further clarify the effects of nickel corrosion on solder wetting balance test results and the resultant intermetallic formed. The study will attempt to produce level 1, level 2, and level 3 corrosion as denoted by IPC-4552 rev A and tabulate wetting balance results and congruity of intermetallic formed.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Events Calendar | Wed Sep 11 00:00:00 EDT 2024 - Wed Sep 11 00:00:00 EDT 2024 | San Diego, California USA
San Diego Chapter In-Person Event: Reclaiming Precious Metal from SMT Scrap
Career Center | , Maryland USA | Engineering
Late stage start-up company, well into commercialization, that develops and manufactures products to precisely control the instantaneous release of heat energy for reaction initiation and joining applications. Building from its strengths in material
Career Center | Javalera, Gen. Trias, Cavite Philippines | Engineering
Numonyx is a semiconductor company making flash memories, which was founded on March 31, 2008 by Intel Corporation, STMicroelectronics and Francisco Partners. The company supplies non-volatile memory for a variety of consumer and industrial devices i
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control,Research and Development,Sales/Marketing
AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control
AOI - Omron RNS_ptH, RNS-LS, VT-WIN2 VI3000 Marantz 22X IPC 610D certified ISO 9001-2008, etc automotive standards ROHS
SMTnet Express, November 19, 2017, Subscribers: 30,938, Companies: 10,768, Users: 23,942 To Quantify a Wetting Balance Curve Frank Xu Ph.D., Robert Farrell, Rita Mohanty Ph.D.; Enthone Wetting balance testing has been an industry standard
| http://www.thebranfordgroup.com/DNN3/Auction/FINI0323.aspx
Auction - Electronic Test & Measurement Equipment | The Branford Group Sign Up For Our Auction Email Alerts! Home Auctions Upcoming Auctions Recent Auctions Asset Recovery Programs Industry Expertise Logistics
| https://www.eptac.com/wp-content/uploads/2007/10/webinar_eptac_10_17_07.pdf