Industry Directory | Consultant / Service Provider
Elmet LLC is an accredited lab, primarily providing cross sectioning of circuit boards, visual and x-ray inspections of PCBAs and other metallographic and metallurgical services including SEM examination and EDS analysis.
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New Equipment | Industrial Automation
Sandy.[mailto:unity@mvme.cn] Sandy.[WhatsApp/Skype/Mobile:+8618020776786] Sandy.[Quote to you within the shortest possible time with our best price] Warranty: up to 12 months Shipping: fast delivery is available NEW+ORIGINAL+IN STOCK+ONE
New Equipment | Industrial Automation
Sandy.[mailto:unity@mvme.cn] Sandy.[WhatsApp/Skype/Mobile:+8618020776786] Sandy.[Quote to you within the shortest possible time with our best price] Warranty: up to 12 months Shipping: fast delivery is available NEW+ORIGINAL+IN STOCK+ONE
Industry News | 2021-05-25 12:56:56.0
The SMTA Officer team is excited to provide our members with a free technical webinar on "The Relationship Between Cleanliness and Reliability/Durability" by Debbie Carboni, Global Product Manager at KYZEN Corporation. The presentation will take place on June 10th at 11:00am EST and include:
Industry News | 2018-10-30 20:12:36.0
IPC’s World PCB Production Report for the Year 2017, published last week, shows how the global PCB industry achieved an estimated 13.9 percent real growth in 2017 – the fastest growth since the recovery year of 2010 – and what the industry’s global footprint looks like today. The report provides current estimates of PCB production value by country, region and product category, with commentary about industry trends and historical data.
Technical Library | 1999-08-27 09:27:10.0
Conformal coating is a material that is applied to electronic products or assemblies to protect them from solvents, moisture, dust or other contaminants that may cause harm. Coating also prevents dendrite growth, which may result in product failure. This paper will discuss the variables that affect the application of conformal coatings, and review in detail those variables that impact the process of selective coating of printed circuit boards.
Technical Library | 2009-10-14 21:17:47.0
Electrochemical migration (ECM) is defined as the growth of conductive metal filaments across a printed circuit board (PCB) in the presence of an electrolytic solution and a DC voltage bias. ECM, also known as dendritic growth, is a critical issue in the electronics industry because the intermittent failure behavior of ECM is a likely root-cause of the high occurrence of field failures identified as no trouble found (NTF)/could not duplicate (CND)
Whatsapp+86 134 2516 4065 We offer a wide range of advanced dispensing solutions, including CCD Vision dispensing systems, AB glue machines, 2-part silicone, polyurethane, and epoxy potting dispensing machines, AB resins compound dosing and dispen
We offer a wide range of advanced dispensing solutions, including CCD Vision dispensing systems, AB glue machines, 2-part silicone, polyurethane, and epoxy potting dispensing machines, AB resins compound dosing and dispensing potting systems, 2K pott
Career Center | EDEN PRAIRIE, Minnesota USA | Production
Logic PD collaborates with clients to help them launch products that accelerate growth and capture value in the Internet of Things (IoT). Logic PD helps at any stage in the product lifecycle by being the complete product innovation and product realiz
Career Center | Van Nuys, California USA | Management,Production
Electronic Source Company, Los Angeles, CA based, Electronic Manufacturing Services (CM) company, servicing the Aerospace, Space, Medical and Telecommunication, for life critical applications/segments, is in search of a hands on, results driven and
SMTnet Express, April 20, 2023, Subscribers: 24,681, Companies: 11,759, Users: 27,899 █ Electronics Manufacturing Technical Articles WHY CLEAN A NO-CLEAN FLUX Residues present on circuit boards can cause leakage currents
| http://etasmt.com/cc?ID=te_news_bulletin,23575&url=_print
(from plating) and to the pad (from hot air leveling or other pcb solder-coating method), an intermetallic of tin-copper forms. This is typically Cu6Sn5 or Cu5Sn6 and this intermetallic is what causes the solder to adhere to the copper pads and leads
| https://www.eptac.com/soldertip/soldertip-48-the-cleanliness-of-wire-and-terminal-connections/
. Boards and assemblies are cleaned of flux residues for a variety of reasons, dendritic growth on More SolderTips SolderTip #36: Wave Soldering Insufficient Fill and Voids in PTH SolderTip #37
