Electronics Forum: what causes solderability failure in enig (236)

problem in solderability

Electronics Forum | Wed Sep 03 17:43:19 EDT 2008 | vladig

No, I don't work for Suntech (me company name is different but close, it much have been misspelled:-)) and the company isn't exactly a trace lab, However, that wasn't the point why I �jumped in�. Defining a problem as �solderability� is too generic.

what are the main diffrences in failure modes for Bga

Electronics Forum | Sat Jul 05 14:07:33 EDT 2008 | shellydhami

Main diffrences in failure modes for mechanically and thermally induced BGA solder joint fracture

Industry News: what causes solderability failure in enig (61)

SMTA International Conference on Soldering and Reliability Program Announced

Industry News | 2011-02-24 20:35:03.0

The SMTA is pleased to announce the program for the 2011 International Conference on Soldering and Reliability being held May 3-6 in Toronto, Ontario, Canada.

Surface Mount Technology Association (SMTA)

How to Prevent Solder Bridging in 3528 PLCC6 RGB LEDs?

Industry News | 2018-10-18 08:34:52.0

How to Prevent Solder Bridging in 3528 PLCC6 RGB LEDs?

Flason Electronic Co.,limited

Technical Library: what causes solderability failure in enig (13)

Eliminating Ni Corrosion in ENIG/ENEPIG Using Reduction-Assisted Immersion Gold in Place of Standard Immersion Gold

Technical Library | 2023-01-10 20:08:36.0

Nickel corrosion in ENIG and ENEPIG is occasionally reported; when encountered at assembly it manifests as soldering failures in ENIG and wire bond lifts in ENEPIG. Although not common, it can be highly disruptive, resulting in missed deliver schedules, supply chain disruption, failure analysis investigations, and liability - all very costly.

Uyemura International Corporation

No-fault-found and intermittent failures in electronic products

Technical Library | 2022-12-05 16:22:13.0

This paper reviews the possible causes and effects for no-fault-found observations and intermittent fail- ures in electronic products and summarizes them into cause and effect diagrams. Several types of inter- mittent hardware failures of electronic assemblies are investigated, and their characteristics and mechanisms are explored. One solder joint intermittent failure case study is presented. The paper then discusses when no-fault-found observations should be considered as failures. Guidelines for assessment of intermittent failures are then provided in the discussion and conclusions.

CALCE Center for Advanced Life Cycle Engineering

Videos: what causes solderability failure in enig (3)

Electronics in Harsh Environments Conference 2019 Summary

Electronics in Harsh Environments Conference 2019 Summary

Videos

Hear what attendees had to say about the Electronics in Harsh Environments Conference. Start planning your participation for the 2020 event: 21-23 April 2020 | Amsterdam, Netherlands https://www.smta.org/harsh

Surface Mount Technology Association (SMTA)

I.C.T | AOI Optical Inspection Machine For SMT Components and DIP Solder Joint

I.C.T | AOI Optical Inspection Machine For SMT Components and DIP Solder Joint

Videos

I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the cir

Dongguan Intercontinental Technology Co., Ltd.

Events Calendar: what causes solderability failure in enig (4)

Auburn University Student Chapter Event: Get Hired in Electronics Industry

Events Calendar | Fri Apr 16 00:00:00 EDT 2021 - Fri Apr 16 00:00:00 EDT 2021 | ,

Auburn University Student Chapter Event: Get Hired in Electronics Industry

Surface Mount Technology Association (SMTA)

Harsh Environment Failure - Causes & Cures - FREE Pre-Conference Webinar

Events Calendar | Tue Apr 07 00:00:00 EDT 2020 - Tue Apr 07 00:00:00 EDT 2020 | ,

Harsh Environment Failure - Causes & Cures - FREE Pre-Conference Webinar

Surface Mount Technology Association (SMTA)

Career Center - Resumes: what causes solderability failure in enig (1)

Engineering/Technical/Technician

Career Center | Baguio City, Philippines Philippines | Engineering

  Responsible to effectively utilize all of the available resources such as machines, materials, manpower and methods in order meet the Offsite metric goal  according to the customers’ specifications, requirements and needs;   Responsible for evalua

Express Newsletter: what causes solderability failure in enig (1067)

Strength of Lead-free BGA Spheres in High Speed Loading

Strength of Lead-free BGA Spheres in High Speed Loading Strength of Lead-free BGA Spheres in High Speed Loading Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general

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