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New Equipment | Industrial Automation
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New Equipment | Industrial Automation
Sandy.[mailto:unity@mvme.cn] Sandy.[WhatsApp/Skype/Mobile:+8618020776786] Sandy.[Quote to you within the shortest possible time with our best price] Warranty: up to 12 months Shipping: fast delivery is available NEW+ORIGINAL+IN STOCK+ONE
Electronics Forum | Fri Apr 03 15:30:10 EDT 2009 | ed_faranda
I have a VJE Summit 750 Rework machine... I don't think that matters much, but I put it out there anyway. I am removing a BGA (29mm x 29mm) off a board, but some of the pads on the board are being lifted during the process. Does someone have any
Electronics Forum | Mon Jan 17 02:02:38 EST 2000 | PC
Can anyone there please tell me what can cause the SMt chip terminal lifted? This happen quite often and I can't find the rootcause for this problem. Does it cause by material/Placement?? Thanks
Industry News | 2018-10-18 08:14:11.0
How to Prevent the Tombstone and Open Defects during the SMT Reflow Process
Industry News | 2018-10-18 08:34:52.0
How to Prevent Solder Bridging in 3528 PLCC6 RGB LEDs?
Technical Library | 2013-01-17 15:37:21.0
A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
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SUMMARY OF RESPONSIBILITIES The purpose of this position is to provide guidance and support to the production operations in the area of responsibility and to provide a work environment where coworkers have the tools, training and leadership to build
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
) Beam broken between bond and edge of silicon. (d-6) Bond lifted. (d-7) Lifted metallization (separation of metallization) from die, separation of bonding pad. (d-8
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/operator/printed-circuit-board-repair/
& practical exam with a combined score of 80% or better WHAT THE “LEARNER” RECEIVES: 80 – 90% “Hands-on” application Student manual Pad & Trace repair practice kit Pad
