Electronics Forum | Fri Apr 03 15:30:10 EDT 2009 | ed_faranda
I have a VJE Summit 750 Rework machine... I don't think that matters much, but I put it out there anyway. I am removing a BGA (29mm x 29mm) off a board, but some of the pads on the board are being lifted during the process. Does someone have any
Electronics Forum | Mon Jan 17 02:02:38 EST 2000 | PC
Can anyone there please tell me what can cause the SMt chip terminal lifted? This happen quite often and I can't find the rootcause for this problem. Does it cause by material/Placement?? Thanks
Industry News | 2022-11-11 07:33:41.0
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.
Industry News | 2022-10-13 07:44:15.0
I.C.T SMT Vacuum Reflow Oven Machine helps you to solve the problem of High Solder Voids Rates
Technical Library | 2013-01-17 15:37:21.0
A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
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) Beam broken between bond and edge of silicon. (d-6) Bond lifted. (d-7) Lifted metallization (separation of metallization) from die, separation of bonding pad. (d-8
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