PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic3004&OB=ASC.html
. I am currently working on a BGA footprint with .26mm nominal ball size and .5mm pitch. Is my understand correct that when ball pitch is
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. The root cause of voids in solder joints is understood and has been documented in numerous publications on the topic [1-3]. There are industry guidelines for characterizing voiding [4, 5
