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Developing a Reliable Lead-free SMT Assembly Process

Developing a Reliable Lead-free SMT Assembly Process Developing a Reliable Lead-free SMT Assembly Process What are the key process requirements to achieve reliable lead-free SMT assembly? Lead-free SMT can be achieved reliably if several

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ECSS-Q-ST-70-18C

| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf

5.2.1 Solder a. The  supplier  shall use  solder  ribbon, wire and preforms, provided  that  the alloy and flux conform to the requirements on “material selection” of  ECSS‐Q‐ST‐70‐08.  NOTE 1  The following solder alloys are approved:  • 60  Sn

US0683966

GPD Global | https://www.gpd-global.com/co_website/pdf/GPD-Global-CMRT-2021.xlsx

contact. This field is mandatory. 9. Insert the name of the person who is responsible for the contents of the declaration information. The authorizer may be a different individual than the contact person. It is not correct to use the words ‘‘same’’ or

GPD Global


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