SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
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testing. At present, what we use the most is high-temp solder. High-temp solder SMT-adhesive or high-temp adhesive tape is used to fix the test head of memory device’s thermocouple to PCB’s test points and then high-temp adhesive or glue is used to fix the
GPD Global | https://www.gpd-global.com/pdf/doc/Dispense-System-Service-Guide-22290008G.pdf
shielding accommodate the conveyor. CE SAFETY CERTIFICATION: DO NOT alter the machine in any way not specified in this document or CE safety certification will be void. Equipment is to be used only for its intended purpose. 3/30/22 Dispense System Service
