SMTnet Express, September 7, 2017, Subscribers: 30,782, Members: Companies: 10,712, Users: 23,761 Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift Young K. Song and Vanja Bukva; Teledyne DALSA As a surface finish for PCBs
SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk
Heller Industries Inc. | https://hellerindustries.com/intermetallics-growth/
). Over time, as this intermetallic layer grows thicker, it becomes the Achilles Heal of the solder joint in terms of integrity. Depending upon the stresses imposed on the assembly and the solder joints, this is what usually ultimately leads to joint cracking and failure
Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-prototyping-what-you-should-be-looking-for/
) components can be on the top, bottom, or both sides. You can also specify the SMD pitch and the number of pads. If through-hole punching is selected, specify the smallest hole diameter (0.010–0.015, or greater
