Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
SMTnet Express, May 14, 2015, Subscribers: 22,738, Members: Companies: 14,345 , Users: 38,183 Reliability of Stacked Microvia Hardeep Heer, Ryan Wong; Firan Technology Group The Printed Circuit Board industry has seen a steady reduction in pitch
Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures More and more chip packages need
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electronic components or cause the circuit board to be burnt and other adverse effects. What is the working principle of Lyra Reflow Oven cooling zone
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electronic assemblies and components. The presentation will cover when CT X-ray is an appropriate method to be used. It will discuss what types of features and defects can be discerned. Multiple case studies in failure analysis will be reviewed. These will
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