SMT Express, Issue No. 5 - from SMTnet.com Volume 1, Issue No. 5 Wednesday, October 13, 1999 Featured Articles Book Review Conductive Adhesives for Electronics Packaging - editor: Johan Liu by Brian Ellis Wow! Now this is a book! I can
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. Also the PC board will then usually be located in the first quadrant where the component coordinates (x;y) will both be positive. I mportant: Set Reference 1 to the XY origin 0,0: For consistent results when exporting your output files to set up your
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? Also, how do you avoid bubbles in the coating? Read More Vapor Phase Soldering to Immersion Tin Plated Pads QUESTION Question: I have a customer who seems to be having issues making acceptable solder connections using the vapor phase process
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