Industry Directory | Manufacturer
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
Industry Directory | Equipment Dealer / Broker / Auctions / Manufacturer
Focusing on the SMT field for more than 18 years, kinds of smt spare parts,like feeder ,nozzles,motors,fitlers and smt machine,juki ,panasonic ,yamaha,siemens,samsung(hanhua) ; peripheral equipment ,conveyor,AOI,spi,reflow oven
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
Jetting Simplified Jetting pumps are excellent for dispensing small volumes of fluid at high rates of speed. The NCM5000 simplifies jetting to its basic elements - this means easy set up, cleaning, and maintenance for you. The drive system is design
Electronics Forum | Thu Sep 06 10:58:49 EDT 2001 | davef
If your words imaged correctly, it seems a bit strange to have a trace that is wider than the pad where it connects, because we�re used to seeing a narrower trace connecting to a wider pad. It�s tough to determine what the designer was thinking abou
Electronics Forum | Tue Apr 05 12:03:39 EDT 2022 | my3sons
Hello, we can offer you a great solution for handling these LED's which I'm betting are sticking to the nozzle after placement correct? We use a special tip material that doesn't stick...our part # 2014-2146 $450.00
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Used SMT Equipment | Pick and Place/Feeders
1. Manufacturing location of yamaha medium-speed placement machine 2. YV100XG factory year period 2000-2006; YV100XGP general year: 2005-2007 (now discontinued; only second-hand equipment is on sale in the market) 3. This model is a medium-
Used SMT Equipment | Pick and Place/Feeders
1. Manufacturing location of yamaha medium-speed placement machine 2. YV100XG factory year period 2000-2006; YV100XGP general year: 2005-2007 (now discontinued; only second-hand equipment is on sale in the market) 3. This model is a medium-
Industry News | 2016-05-10 14:16:16.0
GPD Global offers individual pumps for integration into your existing platform – the Jetting NCM5000 Pump is one of them. The Jetting NCM5000 Pump simplifies jetting to its basic elements: hammer, pin, and nozzle. Only the pin and nozzle are wetted parts. This means easy set-up, cleaning, and upkeep.
Industry News | 2018-09-06 12:12:07.0
GPD Global offers the ideal tabletop robots (Catalina Series) for precision dispensing.
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Parts & Supplies | Pick and Place/Feeders
CL 8mm feeder for 0201 component (with green handle) if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.
Parts & Supplies | Component Packaging
KV7-M8171-00X plate spring use for Smt Chip mounter copy new KV7-M811S-A0X SPLINE SHAFT SPARE KV7-M8106-00X SHAFT SPLINE KV7-M8108-00X GUIDE SPRING 2 KV7-M8109-01X STOPPER, SHAFT 1 2 KV7-M8110-00X STOPPER, SHAFT 2 2 KV7-M8149-00X PLATE,
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-12-18 21:07:29.0
Selective soldering utilises a nozzle to apply solder to components on the underside of printed circuit boards (PCBs). This nozzle can be moved to either perform dips (depositing solder to a single component) or draws (applying solder to several components in a single movement). The selective soldering methodology thereby allows the process to be tailored to specific joints and allows multiple nozzle types to be used if required on the circuit board. Nozzles can vary by size (internal diameter) and shape (making them suitable for different process types). This is all dictated by board design and process requirements. Selection of the nozzle type is dependent upon the product to be soldered and the desired cycle time. Examples of different nozzle types are shown here. Hand-load selective systems must be programmed with the parameters for multiple solder joints. However, many in-line systems are designed to be modular. This modularity allows for multiple solder stations with different conditions/nozzles to achieve low cycle times. Figure 1 shows the two distinct types of selective soldering systems offered by Pillarhouse International Ltd.
https://www.ascen.ltd/Products/Component_lead_forming_machine/ Motorized version ASCEN taped component axial lead forming machine AS-809F axial lead former, use for cut and bend axial components braid resistor,capacitor, inductor, diode and other ele
https://www.ascen.ltd/Products/Component_lead_forming_machine/ Motorized version ASCEN taped component axial lead forming machine AS-809F axial lead former, use for cut and bend axial components braid resistor,capacitor, inductor, diode and other ele
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
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Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Career Center | Princeton, Texas USA | Production,Quality Control
I have years of experinece in the electronics field which include: component verification, prepping thru hole parts, building pc boards, soldering thru-hole and smt boards, QA etc.
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-substrate/
Close Search Which PCB Substrate Should I Use? By Behind the Work June 16, 2022 August 7th, 2023 Blog , Industry News No Comments What is the best PCB substrate for your next printed circuit board project
| https://pcbasupplies.com/pillarhouse-5-0mm-5-0mm-af-0805-01/
Count On Tools AF-0805-01 Login Create Account Contact View My Cart Menu × Categories Hand Soldering & Rework Automation Tooling PCB Support Systems Soldering Robots Material Handling Dry Storage Cabinets Component Handling Selective Solder Nozzles Pick
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