Electronics Forum | Sat Aug 03 01:40:24 EDT 2019 | sarason
I own a metcal for the high precision work 1500$ in 1992 tips $60 in 1992 and have only used one tip in all that time, have horses holves for large pin devices, precision points for 0402 and a largest tip for service work. Also have Hakkos for bulk
Electronics Forum | Wed Aug 31 08:13:55 EDT 2011 | rway
Unless they are using a contract mfg to build the boards for them, in which case I would request they still clean them, at a price.
Industry News | 2019-08-12 20:03:57.0
MIRTEC, ‘The Global Leader in Inspection Technology,’ today announced that it will display its award-winning 3D AOI, 2D AOI and SPI Inspection Systems in booth #1C55 with Mir Tech-win at the upcoming NEPCON ASIA (NEPCON SOUTH CHINA) exhibition, scheduled to take place August 28-30, 2019 at the Shenzhen Convention & Exhibition Center in China.
Industry News | 2013-11-21 18:07:17.0
The company has demonstrated an unrivaled ability to understand the complexity of electronics assembly as well as key customer needs
Technical Library | 2019-04-11 05:59:57.0
Are your MSD safely stored? As humidity is found to be one of the key reasons for rejected products, many manufacturers are taking measures to control the humidity to increase their production efficiency and save the cost. In the industries of semi-conductor and electronics, the key section in which the rejected products are most probably to be made is that during the heating process of SMT, the IC(e.g.,PBGA,BGA,or TQFD) is likely to crack and thus cause non-effective welding because of the humidity. Climatest Symor® auto dry cabinet is the best solution to avoid the cracking and non#2;effective welding by dehumidifying the surface of your components. The dry unit can be used for 20 years without replacement,and controller is calibration free within 5 years.We attach dry cabinet application with different humidity range,welcome to download.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
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