The KICstart²™ thermal profiler utilizes core technologies developed by KIC, the world’s premier thermal profiling company, and is supported by KIC’s worldwide organization. Packaging these innovative technologies into a low-cost system, the KICstart
New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
Electronics Forum | Mon Jun 27 08:18:47 EDT 2022 | kelvinchoong
Hi All, Appreciate any inputs that may be given. Currently i am operating VP6000 Vapour Phase Reflow Oven from ASSCON. Over the last 2 years, we have around 100 different Recipes for many different PCBs. Each recipe is adjusted(6 Different Paramete
Electronics Forum | Thu Sep 05 11:05:35 EDT 2019 | SMTA-Tony
There are competitors to REL solder alloys from AIM. Tin-Copper-Nickel-Bismuth alloys (Nihon Superior) are an alternative option which do very well in thermal cycle testing. The reflow profiles required are similar to SAC305 profiles. You may als
Industry News | 2018-12-08 03:24:24.0
RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 99, (#ts#)) SMT Express, Volume 4, Issue No. 2 - from SMTnet.com Volume 4, Issue No. 4 Thursday, April 18, 2002 Featured
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/thermal-compounds/thermal-compound
Machine Builders Marine Mobile Devices and Wearables Photovoltaics RFID Fluids Cyanoacrylates Glues Greases Sealants Silicones Resource Center About EFD Certifications 3D Models Buy Online How-to
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic3020&OB=ASC.html
Thermal and analog simulation Centralized library 3. Allegro The Cadence Allegro PCB Designer quickly takes simple and complex designs from concept to production in a constraint-driven design system to ensure functionality and manufacturability
