Industry Directory | Association / Non-Profit
An independent body of ESD experts with the mission to review the ESD robustness requirements of modern IC products for allowing safe handling and mounting
The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs High Speed, High Accuracy, Precision Dispensing System. Higher consistency leads to higher yield and maximum profitability
Design Chain Associates' consulting services help you reduce product time-to-market, risks, and cost while increasing engineering and procurement efficiency. Through our knowledge and expertise in defining and applying best-practice business processe
Electronics Forum | Fri Apr 30 17:47:10 EDT 2004 | davef
look here: http://www.uic.com/wcms/WCMS.nsf/index/White_Papers_4.html
Electronics Forum | Thu Feb 07 14:48:29 EST 2008 | cokedigits
Defecation and waste material disposal methodologies vary by culture. Has anybody done a "white paper" on this? (lol)
Industry News | 2024-09-16 19:59:33.0
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC's Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, "Advanced Packaging to Board Level Integration--Needs and Challenges."
Industry News | 2010-06-04 16:23:16.0
BANNOCKBURN, Ill., USA — The IPC Solder Products Value Council (SPVC) has published a free white paper, Analytical Procedures for Portable Lead-Free Alloy Test Data, that provides a set of test protocols for the evaluation of new lead-free alloys on the basis of their physical properties. Developed in cooperation with leading original equipment manufacturers (OEMs) and electronics manufacturing services (EMS) companies, the white paper will help the electronics assembly industry reduce the time and effort required to characterize an alloy and improve its processes without jeopardizing reliability.
Parts & Supplies | Screen Printers
Name :1016013-04 folder side, MPM MOMENTUM; 125 Part Number :1016013-04; Clamper 3.5mm Description :1016013-04 folder side, MPM MOMENTUM; 125 Applicable models: MOMENTUM series; 125 1016013-04 folder side; MPM MOMENTUM; 125 MOMENTUM; MOME
Parts & Supplies | Screen Printers
Name :1016013-04 folder side, MPM MOMENTUM; 125 Part Number :1016013-04; Clamper 3.5mm Description :1016013-04 folder side, MPM MOMENTUM; 125 Applicable models: MOMENTUM series; 125 1016013-04 folder side; MPM MOMENTUM; 125 MOMENTUM; MOME
Technical Library | 2007-01-31 14:10:17.0
This white paper is suitable for both new and experienced users. It is a practical education in the use and misuse of auger valves for solder paste dispensing.
Technical Library | 2011-03-16 20:09:11.0
The backplane is the key component in any system architecture. The sooner one considers the backplane’s physical architecture near the beginning of a project, the more successful the project will be. This white paper introduces the concept of a backplane
With the Spectrum II's new Precision Z-axis, smaller dots and thinner solder paste lines can be achieved. This capability is standard on all Spectrum II systems and replaces the Precision Z option on the older Axiom products. In order to achieve su
SMT Stencil Production with the LPKF StencilLaser G 6080 The LPKF StencilLaser G 6080 is a highly productive and precise SMT stencil laser cutting system. Learn more: http://www.lpkf.com/products/smt-stencils/cutting-smt-stencils-and-microparts.htm?u
Events Calendar | Thu Jun 08 00:00:00 EDT 2023 - Thu Jun 08 00:00:00 EDT 2023 | ,
SMTA Workforce Development Webinar: PCB Design Courses and Careers in PCB Design
Events Calendar | Thu Mar 24 00:00:00 EDT 2022 - Thu Mar 24 00:00:00 EDT 2022 | Houston, Texas USA
Houston Expo & Tech Forum
Career Center | Cleveland, Ohio USA | Management,Purchasing,Sales/Marketing
Content Procurement Manager Negotiates to acquire rights to utilize content for electronics assembly industry web site. Contacts identified sources and promote benefits of web site as a vehicle for publication and distribution of materials. Sources
Career Center | Plano, Texas USA | Engineering
The following responsibilities/duties are to be carried out under the direction of the Applications Engineering Manager. This list is not exhaustive in nature and additional duties may be assigned as needed. Provide support presence at trade shows,
Career Center | Mysore, India | Engineering,Production,Quality Control,Technical Support
· New Product production line setup, Risk assessment, quality system deployment. · Process Engineering activities, PCB Design review w.r.t Design for manufacturability in Pilot lot. · Printed wiring Assembly Process Improvement (Stencil, PCB type, sc
Career Center | , Minnesota USA | Engineering,Management,Production,Quality Control,Technical Support
Engineer with a diverse background in management, quality, computer and customer service. Experience includes optics, electrical, mechanical, physics, chemistry, process and systems engineering, implementing computers and computer applications for m
Heller Industries Inc. | https://hellerindustries.com/publications/
Reflow Soldering White Papers, Reflow Soldering Technical Articles Home » Reflow Soldering Technical Papers & Articles SMT Reflow Technical Papers
| https://www.eptac.com/faqs/ask-helena-leo/ask/charring-of-wire-insulation
? Do you have any white papers on the topic? Thank... Question: We have an ongoing debate regarding the charring of wire insulation
winsouce.jpg)
