Industry Directory | Manufacturer
PCB solder mask, PCB etching resist ink, LED white solder mask. UV curing solder mask, UV curing anti-acid etching resist ink
Industry Directory | Manufacturer
professional manufacturer of pcb
New Equipment | Rework & Repair Equipment
PMP-500 First Article Tester V2.0 PTI-500 First Article Inspection Tester Overview PTI-500 First Article Inspection Tester is mainly used for the first article inspection of the SMT production process in electronics factories. The operation of the t
auto PCB depaneling machine adopts the latest blade-type light weight design, which completes the micro-shear stress cutting stroke at one time, and is suitable for separating PCB circuit boards with V-grooves. If you want know how to choose the b
Used SMT Equipment | AOI / Automated Optical Inspection
Year 2003 Industrial PC, Win 2000, 2.4GHz, CD R/W, 15 in. monitor S/W version V2.5.1.0 Offline programming software with dongle Cameras: 1x colour digital centre camera, 4 x b&w analogue side angle cameras X axis stroke 350mm, Y axis stroke 450mm Wh
Used SMT Equipment | AOI / Automated Optical Inspection
Offered systems: 2 x Configurations, consisted from: M22XDL460 AOI ,Power Mac G5 PC, Monitor 17” Vantage: 2006 Condition: good. Marantz Aoi Systems •Automatic Optical Inspection of PCB’s •Inspects: SMT & THT Components (presence, type, polari
Industry News | 2003-06-13 09:56:46.0
Wire and spring specialist William Hughes can now offer three different versions of its PCB test point - small, large and long-legged in quantities suitable for prototype work or volume production.
Industry News | 2003-04-23 08:21:34.0
Rohm has a new series of ultrasmall high-brightness side-emitting chip LEDs that use built in reflectors and lenses to deliver optimum luminous intensity from minimal PCB footprint and power drain.
Technical Library | 2019-09-24 15:41:53.0
This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications. The coatings consist of: Specialty (green transparent) liquid photoimageable solder masks (LPiSM) compatible with long-term thermal storage/stress in excess of 150°C. Combined with the appropriate high-temperature base material, and along with a suitable copper pre-treatment, these solder resists are capable of fulfilling higher thermal demands. In this context, long-term storage tests as well as temperature cycling tests were conducted. Moreover, the effect of various Cu pre-treatment methods on the adhesion of the solder masks was examined following 150, 175 and 200°C ageing processes. For this purpose, test panels were conditioned for 2000 hours at the respective temperatures and were submitted to a cross-cut test every 500 h. Within this test set-up, it was found that a multi-level chemical pre-treatment gives significantly better adhesion results, in particular at 175°C and 200°C, compared with a pre-treatment by brush or pumice brush. Also, breakdown voltage as well as tracking resistance were investigated. For an application in LED technology, the light reflectivity and white colour stability of the printed circuit board are of major importance, especially when high-power LEDs are used which can generate larger amounts of heat. For this reason, a very high coverage power and an intense white colour with high reflectivity values are essential for white solder masks. These "ultra-white" and largely non-yellowing LPiSM need to be able to withstand specific thermal loads, especially in combination with high-power LED lighting applications. The topic of thermal performance of coatings for electronics will also be discussed in view of printed heatsink paste (HSP) and thermal interface paste (TIP) coatings which are used for a growing number of applications. They are processed at the printed circuit board manufacturing level for thermal-coupling and heat-spreading purposes in various thermal management-sensitive fields, especially in the automotive and LED lighting industries. Besides giving an overview of the principle functionality, it will be discussed what makes these ceramic-filled epoxy- or silicone-based materials special compared to using "thermal greases" and "thermal pads" for heat dissipation purposes.
Technical Library | 2018-10-18 15:41:45.0
One specific market space of interest to emerging printed electronics is In Mold Label (IML) technology. IML is used in many consumer products and white good applications. When combined with electronics, the In Mold Electronics (IME) adds compelling new product functionality. Many of these products have multi-dimensional features and therefore require thermoforming processes in order to prepare the labels before they are in-molded. While thermoforming is not a novel technique for IML, the addition of printed electronic functional traces is not well documented. There is little or no published work on printed circuit performance and design interactions in the thermoforming process that could inform improved IME product designs. A general full factorial Design of Experiments (DOE) was used to analyze the electrical performance of the conductive silver ink trace/polycarbonate substrate system. Variables of interest include trace width, height of draw, and radii of both top and bottom curvatures in the draw area. Thermoforming tooling inserts were fabricated for eight treatment combinations of these variables. Each sample has one control and two formed strips. Electrical measurements were taken of the printed traces on the polymer sheets pre- and post- forming with a custom fixture to evaluate the effect on resistance. The design parameters found to be significant were draw height and bottom radius, with increased draw and smaller bottom curvature radii both contributing to the circuits’ resistance degradation. Over the ranges evaluated, the top curvature radii had no effect on circuit resistance. Interactions were present, demonstrating that circuit and thermoforming design parameters need to be studied as a system. While significant insight impacting product development was captured further work will be executed to evaluate different ink and substrate material sets, process variables, and their role in IME.
03008702-01 VACUUM PLATE COMPLETE f. short Sleeve (red) 03008853-03 STOP CABLE COMPL. F. CENTER COVER 03008862-03 NOZZLE / NP-ADJUSTMENT TH 03008951-01 CABLE: EXTENSION IN/OUT SIDE 03009198S01 PANEL COMPLETE WITH CABLE / X-SERIES
03009202S01 SLIDER / HANDLE X-SERIES 03009210-04 TRAILING CABLE ANALOGOUS 1P 03009259S02 CUTTER UNIT (SIPLACE HF) 03009269S02 DC-Gear motor with synchronizing disc 03009270-01 DC-Motor 2657 W 048CR 32/1 7:1 03009343S01 LABEL NUMBER 204 03009391
GPD Global | https://www.gpd-global.com/co_website/pdf/pump/Phosphors-LED.pdf
. The spectral characteristics of this phosphor govern the quality of white light emitted by the LED. It requires several parameters to quantify the quality of this emission, including the colour or chromaticity point (x,y
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/about-adhesives/sustainability/replace
Nozzles Pumps and Pump Systems Markets Appliance & White Goods Automotive e-Mobility Building & Home Construction Hygiene & Medical Disposable Electronics Solar Filter Manufacturing Tobacco Furniture
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