| http://etasmt.com/cc?ID=te_news_industry,24163&url=_print
solder’s melting point, so that the cold-spot temperature will catch up with it. After each component reaches the same temperature, another quick temperature rising program will raise component temperature to the peak one, which can avoid partial cold soldering or partial high
| https://www.smtfactory.com/I-C-T-Automated-Optical-Inspection-AOI-to-Improve-SMT-Line-Efficiency-id43297267.html
. Which be placed at the front end of the reflow oven to test the SMT condition of th e SMT machine. Placed at the back end of reflow soldering is used to detect the PCBA after soldering. Both I.C.T-V5200 and
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