Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef
1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use
Electronics Forum | Tue Aug 21 08:44:48 EDT 2001 | caldon
A) The standoff height of some uBGA components does not allow water to penatrate under the component. B)Water soluable may dilute the flux and not remove it all together. This can be tested with Ion Chromatography. C) Water soluable in some cases ne
SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Front Page BGA REWORK Earl Moon Proof Of Design (POD) COMPARE PART SQUARENESS TO BOARD'S SILK-SCREEN OR TRACES A part
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/blog/the-power-of-2d-and-3d-inspection
. The results of this can be seen below. Multiple 3D rendered views of the BGA device. It can clearly be seen there is a difference in the ball shape highlighted with red arrows compared with surrounding balls
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