Industry Directory | Manufacturer
OMG is the manufacturer of the Microbond line of solder pastes, fluxes and solder spheres.
Industry Directory | Manufacturer
Manufacturer of Selective Soldering Systems, Ersascope BGA Inspection Systems, BGA Rework Systems, Soldering Irons, Wave Solder and Reflow Equipment.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
New Equipment | Education/Training
IPC - Association Connecting Electronics Industries® offers globally recognized industry-traceable training and certification programs on key Electronics Industry Standards. Blackfox, founded in 1996, is the premier Worldwide Approved IPC Training Ce
Electronics Forum | Tue Mar 20 14:34:45 EDT 2007 | realchunks
Hi Bill, Gasketing between the board and stencil may leak alittle, giving you a fuzzy print. If not, you should be OK. Another variable may be you need to perform an understencil wipe more often, adding to your cycle time. So why ya wanna double
Electronics Forum | Wed Mar 21 13:21:53 EDT 2007 | scooter
I wish you wouldn't have asked why! We had a rush job and the stencil maker used a frame (normally we don't use the frame type) and placed in the frame wrong so in order to get it to work we printed in both direction. So I thought maybe we should do
Used SMT Equipment | SMT Equipment
Product name: KE – 3010ACL high-speed chip mounter Acl. Product code: KE - 3010 Detailed product introduction Characteristic： Constantly improve the KE series products. So as to realize the high speed high quality electric production line of f
Used SMT Equipment | Soldering Equipment/Fluxes
SE500ULTRA The SE500ULTRA is an inline Solder Paste Inspection system that inspects solder deposits. The SE500ULTRA helps to prevent product ion problems by not if ying operators when the print process moves outside the control tolerances. The S
Industry News | 2003-06-05 08:11:23.0
Kerry co-solvent system pays for itself in 13 months
Industry News | 2023-10-16 12:50:01.0
MIRTEC announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World's leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC's Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World's Most Technologically Advanced 3D AOI System!
Parts & Supplies | SMT Equipment
DEK265 printing security door Applicable models: INFINITY HORIZON if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alic
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Parts & Supplies | Circuit Board Assembly Products
Test card printing images (KXFE00DUA00) of Panasonic if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.co
Technical Library | 2017-03-30 18:34:52.0
There are multiple methods, each with its associated benefits for given applications, for printing either solder paste or paste flux for BGA rework. Each of these methods is best-suited for a given situation, board layout and skill level of operators performing the BGA rework. This discussion will layout the various methods and present the specific circumstances for which the specific technique is most wellsuited. In addition, the pluses and minuses for each of the approaches will be discussed in detail.
Technical Library | 2018-11-06 12:42:25.0
Solder paste is a homogeneous, stable suspension of solder powder particles suspended in a flux binder, and is one of the most important process materials today in surface mount technology (SMT). By varying the solder particle size, distribution and shape, as well as the other constituent materials, the rheology and printing performance of solder pastes can be controlled. Paste flow behavior is very important in defining the printing performance of any paste.The purpose of this paper is to study the rheological behavior of SAC (Sn-Ag-Cu) solder paste used for surface mount applications in the electronic industry. The reason why the rheological tests are presented in this paper are two critical sub-processes: aperture filling and paste withdraw. In this paper, we report on the investigation of the rheological profiles, the serrated cone-to-plate system was found as effective in parameter minimizing the wall-slip effect
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon May 10 00:00:00 EDT 2021 - Mon May 10 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Manual Cleaning of Printed Board Assemblies – Step by Step Guide
Events Calendar | Tue Apr 14 00:00:00 EDT 2020 - Tue Apr 14 00:00:00 EDT 2020 | ,
Why Are We Cleaning No-Clean?
Career Center | San DIego (Mira Mesa), California USA | Engineering,Maintenance,Production
Duties: Supports, develops and optimizes manufacturing processes. Reviews quality metrics to help produce high quality, repeatable processes. Assists with supporting and improving the SMT process (print process, placement, reflow, package-o
Career Center | New Castle, Pennsylvania USA | Production
Surface Mount Tech - Printed Circuit Board (PCB) Summary: **All applicants must be familiar with: Quad 4C equipment*** Will be responsible for Surface Mount Parts and Screen Printing Other responsibilities may include: Moves controls to activate
Career Center | INDIA, India | Engineering,Quality Control
BACHELOR OF ENGINEERING IN ELECTRICAL AND ELECTRONICS ENGINEERING EXPERIENCE IN SURFACE MOUNT MANUFACTURING TECHNOLOGY.
Career Center | Riyadh 11623, Philippines | Engineering,Maintenance,Production
PROFESSIONAL EXPERIENCE: Connected in the field of manufacturing/electronics industry experienced in the line, Through Hole and Surface Mount Technology, worked on various Fuji Machines Universal model, such as: CP 643E chip shooter QP 242E chip mou
SMTnet Express, February 9, 2017, Subscribers: 30,132, Companies: 15,113, Users: 41,841 Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue? Eric Bastow; Indium Corporation The SMT assembly world
| https://www.smtfactory.com/China-Automatic-Solder-paste-printer-Factory-Supplier-pd42676824.html
Solder Stencil Printer,solder paste stencil Machine,solder printing Machine,solder screen printing,PCB Printer Machine Price,Pcb Stencil Printer,Smt Stencil Printer Machine,Smt Printing Machine
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/efd-products/fluxplus-paste-flux
. Dispensing Flux Printing Flux Flux Type RMA RA NC WS WS WS WS RMA NC WS Flux Class J-STD-004B ROL0 ROL1 ROL1 ORH1 ORH1 ORL0 ORH1 ROL0 ROL1 ORL0 Formula 07D00 41D00 21D00 71D00 72D00 63D00 67D00 08P00
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