New Equipment | Assembly Services
No. Items technological Capability 1 Layer 1-20 layer 2 Copper thickness 0.5-4.0oz 3 Board thickness 0.2mm-6.0m
SMTnet Express, April 7, 2022, Subscribers: 25,732, Companies: 11,564, Users: 27,174 Effect Of Vacuum Reflow On Solder Joint Voiding In Bumped Components Voids affect the thermal characteristics and mechanical properties of a