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Layer Count: 8L Board Thickness: 1.0mm Panel Dimension:190*86mm/2up Material: S1141 Copper on board surface: 35μm Min Hole Diameter: 0.1mm Min line Width/Space: 8/8mil Surface Finish: ENIG+Selective OSP in BGA area This quick turn PCB is manufacture
Layer Count: 2L Board Thickness: 0.8mm Dimension: 140*85mm Material: Rogers RO5880 Surface Copper: 35μm Min Hole Diameter: 2.0mm Min line Width/Space: N/A Surface Finish: ENIG Do you need a PCB for special signal requirement into your products? High
Electronics Forum | Tue Dec 12 19:57:56 EST 2017 | myke03o
Hi Experts. We have an expired OSP pcb and we wanted to extend the shelp life. Is it possible to rework the PCB by removing the OSP coating, micro etching and re-applying OSP finish. Any advice if this can be done? Any solution for this OSP pcb e
Electronics Forum | Wed Feb 14 15:54:18 EST 2018 | cbart
do you see signs of contamination or oxidation? if not why not just send them to the board house and have another OSP coating layer applied?
Industry News | 2013-08-07 09:58:46.0
The SMTA launched an online re-certification program for engineers whose 10-year SMT Processes Certification is expiring.
The Surface Finish Effect on the Creep Corrosion in PCB SMTnet Express May 10, 2012, Subscribers: 25098, Members: Companies: 8865, Users: 33085 The Surface Finish Effect on the Creep Corrosion in PCB First published in the 2012 IPC APEX EXPO
SMTnet Express, November 25, 2015, Subscribers: 23,782, Members: Companies: 14,767, Users: 39,402 Study of Various PCBA Surface Finishes Georgie Thein, David Geiger, and Murad Kurwa.; Flextronics International In this study various printed circuit
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
-free Solder Alloys with OSP and Immersion Silver PCB Finish,” Proceedings of SMTA International 2005, Chicago, IL, USA, Sept. 25-29, 2005, pp. 568-575. Siewert, T.; Liu, S.; Smith, D. R.; and Madeni, J. C., (2002), “Database for Solder Properties with
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
+125oC for 5800 cycles. It was observed that ENIG surface finish improves the component reliability comparing to OSP and ImAg. It is also observed that matching solder sphere with solder paste alloys improves the reliability in several cases, but a significant improvement was not observed when compared with the SAC305 solder spheres
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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