S3088 ultra with high-performance sensor technology XM 3D - the new standard in assembly inspection. High-speed solder joint inspection. Highest inspection depth. Simple operation. In today's electronics manufacturing environment, reliable and econ
Click here to view the SlimKIC 2000 datasheet Profiling So Easy, Anyone Can Do It By automating the complex task of process set up the SlimKIC® 2000™ makes profiling so easy that any operator can quickly achieve the optimal process. Simply select fro
Electronics Forum | Tue Oct 23 07:03:52 EDT 2007 | davef
We're not really sure. Usually when solder leaves the pads and wicks-up a component lead, it means the component lead is much warmer than the pad on the board. This is the direction we would have taken this if we hadn't taken the AgPd / conductive e
Electronics Forum | Tue Sep 16 17:03:34 EDT 2014 | rangarajd
We have an issue with solder wicking up the leads/ inside terminations on an SMT connector. The solder coverage is sometimes over 50% of the connectors inside pin length. The terminations are gold plated. Is there an IPC spec for acceptability? Plea
Industry News | 2020-11-03 18:16:39.0
2020 Global Surface Mount Technology Company Of The Year Award (Soldering Equipment)
Industry News | 2021-11-08 14:38:39.0
Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.
Technical Library | 2015-02-12 13:32:52.0
Market forces, particularly legislation against the use of lead in electronics, have driven electronics manufacturers towards lead-free solders for PCB assembly and rework. This approach creates challenges because of the relatively high temperatures needed for lead-free soldering. Additionally, lead-free solder alloys typically do not wet or wick as easily as Sn63Pb37 leaded types. As PCBs often include both BGAs and simpler discrete devices, a lead-free rework capability should include a suitable soldering station and a BGA rework station. This article shows how such equipment can be adapted to overcome the lead-free issues and provide a successful reworking facility.
Technical Library | 2021-08-11 00:55:44.0
In this article, the influence of shrinkage tensile stress in potting materials on the anti-overload performance of a circuit board was studied. Firstly, the phenomenon of shrinkage tensile stress in common potting materials was analyzed, and it was found that the commonly used potting adhesives displayed large shrinkage characteristics. Secondly, a small experiment was set up to verify that the shrinkage tensile stress of potting adhesives would lead to printed circuit board (PCB) deformation, and the shrinkage stress was contrary to the acceleration direction of overload. Thirdly, the influence of potting adhesives on the overload resistance of the PCB was analyzed.
https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/100.html PCB linking conveyor and PCB belt conveyor mainly used to connect different type PCB board handing equipment effectively for the SMT production line. ASCEN technology is ava
https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/100.html PCB linking conveyor and PCB belt conveyor mainly used to connect different type PCB board handing equipment effectively for the SMT production line. ASCEN technology is ava
Events Calendar | Thu Oct 21 00:00:00 EDT 2021 - Thu Oct 21 00:00:00 EDT 2021 | ,
Great Lakes Chapter Webinar: Low Melting Alloy & Selection of the Right Chemistry for Reliability
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_ipcjstd001-gull-wing-leads-and-solder-joints_topic2587.xml
;However, the FED in Germany did pick up the Proportional Pad Stack model and published a book on it by Rainer Taube. IPC-J-STD-001 Gull Wing Leads and Solder Joints
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
a connector, ribbon cable leads were manually soldered to the through holes corresponding to each component I/O pair. Figure 8. As-Assembled Test Vehicle Table 3. Test Component Micro-via Design Data Package Ball Pad Pitch (mm) Microvia Concentric
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