Industry Directory | Manufacturer
Dynamic Manufacturing specializes in Electronic Manufacturing Services: Surface Mount Printed Circuit Boards (PCB's), Through-hole PCB's, Prototyping, Testing, Inspection, Conformal Coating, Enclosures. Contract Design: Printed Circuit Boards, Temper
Eliminate reflow oven changeover time. The PYRAMAX ZeroTurn is designed for high volume electronics manufacturers who must also manage process mix and are dissatisfied with the poor process separation of other dual chamber machines. Get more out of
BTU’s Pyramax™ family of high-throughput thermal processing systems is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. Pyramax™ systems provi
Electronics Forum | Thu Apr 07 10:39:36 EDT 2005 | geb
I have a BTU International VIP98 reflow oven, running WINCON Version 2.00C on Windows 98. The light tower only lights green when the oven reaches temperature, and the other colours never light up. Do you know how to set the other colour lights to tu
Electronics Forum | Tue Dec 28 09:31:45 EST 2004 | davef
The ramp rate of the temperature of your solder is more important than the ramp rate of the temperature of the plastic case of your BGA.
Used SMT Equipment | General Purpose Equipment
Very Nice Blue M Oven For Sale See attached pictures and information below Equipment Description Blue M Oven Model Number: CC-09-C-P-E Serial Number: T02G-339526-TG Pro Master Temperature Controller Temperature Range: 350C 6 - 8 degrees/m
Used SMT Equipment | General Purpose Equipment
Thermotron Environmental Test Chamber Cooling Heating and Vibration Model Number: F-110-CHV-25-25-VL Serial Number: 947/8885RF Year 2012 Temperature: 177C to -73 Ramp Rate: 7 degree per minute with a 500 lb. load Includes Console System with
Industry News | 2018-10-18 09:27:40.0
Time Temperature setting wave soldering is the most important in the solder melts
Industry News | 2018-10-18 10:13:08.0
The Application of the Pin-in-Paste Reflow Process
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Parts & Supplies | Pick and Place/Feeders
JUKI 710 head motherboard E8621715BA0 E86227150A0 Other juki parts: E86217210A0 BGA BOARD ASM E86217290A0 TEMPERATURE SENSOR PWB ASM. E86227150A0 HEAD SUB UNIT BASE ASM. E86227290A0 LIGHT 2 PWB ASM. E86237000A0 HEAD RELAY CIRCUIT BOARD ASM E86
Parts & Supplies | Assembly Accessories
PN:JUKI 710 head main board e8621715ba0 e86227150a0 Other juki parts: E86217210A0 BGA BOARD ASM E86217290A0 TEMPERATURE SENSOR PWB ASM. E86227150A0 HEAD SUB UNIT BASE ASM. E86227290A0 LIGHT 2 PWB ASM. E86237000A0 HEAD RELAY CIRCUIT BOARD ASM
Technical Library | 2007-04-04 11:43:41.0
The present work offers a discussion and a first case study to identify and illustrate voiding mechanisms for a particular TIM between a heat spreader and the back of a flip chip. Pronounced differences were observed between stencil printing and dispensing in terms of initial void formation, apparently related to the specific properties of the material. Measurements of the effects of heat ramp rate and peak temperature showed the subsequent evolution and final void size distribution to be determined by the initial part of the cure profile up to the material gelling temperature.
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
Get more out of your SMT line with Pyramax ZeroTurn. Our dual chamber reflow oven eliminates process changeover time while preserving the process control that the Pyramax family of reflow ovens is known for.
Overview of PRO 1600 Forced Convection Reflow Oven in operation. Features include small footprint (31" x 31"), lead free reflow capable, and precise software process control.
Career Center | Thanjavur, India | Production,Quality Control,Technical Support
work in one year and above Quality engineer in sanmina,current work in SMT Technical engineer in coimbatore
Career Center | , | Engineering,Maintenance,Production
Production Planning ~ Supply Chain Management ~ Productivity Management ~ Sub Contracting Management ~ Process Quality Management ~ Process innovation & Lean Mfg ~ Cost efficiency Management ~ Manpower Management ~Multi Skilling & Training, Six Sigma
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_reflow_ovens_btu_paragon98.html
Window’s based WINCON software package provides for full temperature, conveyor speed, monitoring and setpoint, profiling and recipe storage
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/panorama-line-solutions
. Many new products are designed to work in diverse indoor and outdoor environments where they are exposed to moisture, dust, and extreme temperature changes
