Industry Directory | Manufacturer
Industrial Sensor Vision International specializes in advanced camera technology of high resolution fast speed cameras for automation, AOI, 2-D/3-D, SPI inspection and wafer inspection.
Industry Directory | Consultant / Service Provider / Manufacturer / Other
ScanCAD is an industry leader in inspection, measurement, process control and reverse engineering. Our solutions support OEM's, manufacturers, stencil fabricators, repair depots, and others in optimizing quality and yield.
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Specification: 1. Compact and flexible standard systems for high quality connections 2. Ideal price-performance (throughput) ratio 3. Robust frame construction 4. User friendly system configuration including optional plug & play modules 5. Pulsed
New Equipment | Soldering Robots
CW-2A2P,Sample for China Hot Bar Pulse Heat Soldering Machine for FFC FPC PCB Hot Bar Soldering Method for Soldering Two Circuit Boards Together Introduction: This device is designed for double - deck working mode of double wel
Electronics Forum | Mon May 07 11:02:17 EDT 2001 | Singh
Hi all. I am looking into the implementation of the Chip on Board process with eutactic bonding and the then using either gold or aluminum wire to make wedge type wire bonding. Since I am totally new to this, can somebody guide me thru the process,
Electronics Forum | Mon May 07 22:29:52 EDT 2001 | davef
4 wire per sec ... you figure how many you need] Encapsulation ~$120K for a dispenser [10 sec per die ... you figure how many you need] plus a cure oven ~$100k Throw in a another ~$100k for marking and cleaning Check the September 2000 SMTnet New
Used SMT Equipment | AOI / Automated Optical Inspection
3D Wafer Bump &Wire Bonding AOI Inspection system Highest quality 3D Wire-Inspection. With high-resolution, complete inspection is possible even for Foot-shape. Inspect Mirror-surface without Reflection problem. As for PEMTRON'S unique optical techn
Used SMT Equipment | X-Ray Inspection
Very Nice Nicolet Xray Machine For Sale The system is complete and in good working condition See attached pictures and information below Nicolet Imaging Systems Model Number: NXR-1500 Serial Number: 0150011 Year 2000 Variable Speed Joystick
Industry News | 2003-04-17 08:15:33.0
In launching the LA35 series, SMAC reckons it has produced an actuator with unrivalled versatility.
Industry News | 2003-05-22 08:36:27.0
Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability
Parts & Supplies | Pick and Place/Feeders
N510028418AA SENSOR EE-SX910-C2J-R 0.5M N610069934AA トレイフィーダ引出部:NPM Tray Feeder Drawing-out Section:NPM N210097292AC BLOCK 0 N610136671AA 全体カバー:NPM-D Whole Cover:NPM-D N610110951AE X-PLATE(F) 0 N210068065AA SPRING 0 N510026562AA WASHER MMSRB6-0
Parts & Supplies | SMT Equipment
UNIVERSAL Series No. P/N description 201 17190000 RAIL, CAM 202 17191000 SHAFT 203 17195003 DRIVER TIP-RH 204 17195004 DRIVER TIP-RH 205 17196003 DRIVER TIP-LH 206 17196004 DRIVER TIP-LH 207 17197007 FORMER-RH STD 208 171980
Technical Library | 2017-08-31 13:43:48.0
Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Proper optimization of wire bond parameters and machine settings are essential for good yields. Wire bond process can generate a variety of defects such as lifted bond, cracked metallization, poor intermetallic etc. NSOP – non-stick on pad is a defect in wire bonding which can affect front end assembly yields. In this condition, the imprint of the bond is left on the bond pad without the wire being attached. NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes observed and the efforts to address NSOP reduction
Technical Library | 2014-07-24 16:26:34.0
Wire bonding a die to a package has traditionally been performed using either aluminum or gold wire. Gold wire provides the ability to use a ball and stitch process. This technique provides more control over loop height and bond placement. The drawback has been the increasing cost of the gold wire. Lower cost Al wire has been used for wedge-wedge bonds but these are not as versatile for complex package assembly. The use of copper wire for ball-stitch bonding has been proposed and recently implemented in high volume to solve the cost issues with gold. As one would expect, bonding with copper is not as forgiving as with gold mainly due to oxide growth and hardness differences. This paper will examine the common failure mechanisms that one might experience when implementing this new technology.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Milwaukee, Wisconsin USA | Engineering
Responsible for all Wire and die bond process within this fast growing Microelectronics company. Company is constantly upgrading equipment and processes to compete in the fiber optics arena. Company will either hire fulltime or a contract worker who
Career Center | San Diego, California USA | Engineering
MeltroniX is a supplir of MCM/hybrids for the military and space market. We are seeking a process engineer with expertise in wire bonding, including ultrasonic and thermocompession technology.
Career Center | Chennai, India | Sales/Marketing
Experience in sales of inter-connect, passive, active, and electro-mechanical components Product Engineering Role as handling BOM, ECO, ECN in the New product introduction of Philips LCD TV and Kulicke and Soffa wire bonding m/c Process and Quali
Career Center | SanPedro, Philippines | Maintenance,Production
Set-up Equipment machine and ensure its proper operation for costumer satisfaction. Carry out all Proactive Maintenance (PM) tasks such as predictive maintenance, preventative maintenance, failure finding maintenance and calibration maintenan
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc Title: Wire Bonding
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/wire-pull?con=t&page=1
Contact Global HQ Africa Asia Central and South America Europe USA and Canada Wire Pull The principle behind basic wire bond testing is positioning of a hook underneath the wire and pulling in the Z
| https://pcbasupplies.com/koki-solder-wire-s03x7ca-72m-1-0-mm/
Solder Wire S03X7Ca-72M - 1.0 mm - PCBASupplies Login Create Account Contact View My Cart Menu × Categories Hand Soldering & Rework Automation Tooling PCB Support Systems Soldering Robots Material Handling Dry Storage Cabinets Component Handling Selective Solder Nozzles Pick
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