Wire-bonding Technician: Capable of programming, repair and support automatic K&S 1419 wire bonders and MECH-EL /MEI manual bonders, among with other assy equipment. Familiarity with HYBRID assemblies in a semiconductors environment. SPC knowlege.
Industry Directory | Manufacturer
Expertise and equipment to support the most intricate and challenging wire bonding applications. Fine wire wedge bonders, heavy wire bonders, ribbon bonders for backend semiconductor assembly.
New Equipment | Soldering Robots
HSC Hot Bar Soldering Machine with Smart Thermode,FPC Hotbar Bonder,FFC Hotbar Welding CW-2A2B: Fpc Pulse Heat Bonding-the Result of Flexible Circuit Board Hotbar Soldering Pulse Heat Hot-bar Soldering,CW-2A2B Spec
New Equipment | Soldering Robots
FFC FPC to PCB Bonding Machine HSC WelidingMachine,CW-2A2P Working Picture: FFC FPC to PCB Bonding Machine HSC WelidingMachine,CW-2A2P Simple introduction: This device is designed for double - deck working mode of double welding he
Used SMT Equipment | SMD Placement Machines
ETA Electronic equipment CO.,LTD. to provide professional SMT automatic production line solution,The company specializes in SMT chip mounter(New samsung:SM421,SM411,SM100 etc)(second-hand： CP40L; CP40LV; CP45F; CP45FV; CP45FVneo); YAMAHA SMT mac
Used SMT Equipment | Chipshooters / Chip Mounters
ETA Electronic equipment CO.,LTD. to provide professional SMT automatic production line solution,The company specializes in SMT chip mounter(New samsung:SM421,SM411,SM100 etc)(second-hand： CP40L; CP40LV; CP45F; CP45FV; CP45FVneo); YAMAHA SMT mac
Industry News | 2014-05-22 15:42:29.0
Baja Bid announces their next online auction. This event includes assets from OneChip Photonics in Kanata, Ontario Canada.
Industry News | 2014-06-03 13:04:15.0
The OneChip Photonics facility in Kanata; Ontario, Canada will be closing their site and all assets are being sold via an online auction. The bidding for the auction will open promptly at 4:00am EST on June 3, 2014 with Lots 1-512 beginning to close at 11am EST on June 4, 2014.
PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol
The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to
Career Center | Melbourne, Florida USA | Engineering,Production,Quality Control
Engineering Specialist - Advanced Manufacturing Technology organization Palm Bay, Florida � GCSD01041082 Job Description: Work in the Advanced Manufacturing Technology organization on the development, qualification, and implementation of leading-edg
Career Center | San Jose, California USA | Research and Development
Description: Join this team focused on RF Front End Modules (FEM) for the Cellular and Wireless Data markets. You will be part of the Packaging and Assembly team, and support multiple R&D design teams within the Semiconductor Division (WSD) of Avag
Career Center | Silang, Cavite, Philippines | Technical Support
WORK EXPERIENCE :Integrated Microelectronics Inc., (Standard Semi-Custom Group) January 2002-present Position: Equipment Lead technician (Surface Mount Technology Area) :Electronic Assemblies, Inc. January 2001-Dec. 2001 Position: E
Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support
Duties & Responsibilities (Equipment Technician): Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment. Conduct Preventive maintenance
Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_semiconductor_esec3006.html
ESEC 3006 ESEC Sempac Wire Bonder Model # 3006S Type W112 Fab No 300357 Year 1999-2000 1.44 MB Floppy Olympus Microscope-Model SZ30
| https://www.smtfactory.com/Samsung-Pick-And-Place-Machine-Development-History-id40845177.html
: Launched CP-11 high-speed pick and place machine development, launched SWB--100G wire bonder 1996: Launched medium-speed CP--30 high-speed pick and place machine
