Industry Directory | Manufacturer
Industrial Sensor Vision International specializes in advanced camera technology of high resolution fast speed cameras for automation, AOI, 2-D/3-D, SPI inspection and wafer inspection.
Industry Directory | Manufacturer
Depanelizer Equipment and Tools For Electronic Assembly. PCB Racks and Trays. Wire Crimp Press and Tooling.
Technical parameter： Model 1200 Printing area 1250×320mm Fixed printing position PCB Outer Or Pin Positioning Table trimming Front/Back±
New Equipment | Cleaning Equipment
Supply suction nozzle cleaning machine, automatic / SMT suction nozzle cleaning machine / Shenzhen manufacturer details Product Name: suction nozzle cleaning machine Product model: hn-nc207 Application: use pulse pressure cleaning method to remove
Electronics Forum | Thu Dec 29 10:47:05 EST 2005 | Chris
The paper Dave posted the link for is great. I have to go back and read it in depth. I can build prototypes by wirebonding to ENIG. I can do it on a manual wirebonder but I don't have the patience to do it on a magazine to magazine automatic machi
Electronics Forum | Mon Mar 07 15:41:50 EST 2005 | John M
Is anyone aware of standards which would identify the clean room requirements for the wire bonding process ?
Used SMT Equipment | Wire Strippers
We have an immediate need for Autosplice SAS splice machines. If you have one, or multiple; please contact me asap. Thanks ashlin@bajabid.com 813-992-2437
Used SMT Equipment | Labeling Systems
CBP / TP 5Kg Cold Bump Pull/ Tweezers Pull Cartridge along with JAW Nordson Dage 4000 Bond Tester DAGE 4000 CBP/TP 5KG Qty:2 Condition : Excellent working condition with many Modules all form Europe user Email:13560819457@139.com
Industry News | 2013-11-13 12:39:14.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it was awarded a 2013 Global Technology Award in the category of LED Production Equipment for its MV-9XP LED Package Inspection System.
Industry News | 2014-09-30 18:49:51.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it was awarded a 2014 Global Technology Award in the category of LED Production Equipment for its MV-9XP LED Package Inspection System.
Parts & Supplies | Pick and Place/Feeders
SAMSUNG ORIGINAL NEW 12MM FEEDER WIRE FOR SMT MACHINE More Samsung feeder parts in stock 125X40X133MM Samaung Thimble 300X56X66MM Samaung Soft Thimble Pin J1301023 Samaung Feeder Snap spring J7066039A Samaung Feeder Spring J8100123A Samaung CP
Parts & Supplies | Pick and Place/Feeders
Samsung KSUN SMT 12MM Feeder Wire More Samsung feeder parts in stock 125X40X133MM Samaung Thimble 300X56X66MM Samaung Soft Thimble Pin J1301023 Samaung Feeder Snap spring J7066039A Samaung Feeder Spring J8100123A Samaung CP45 8X4 Feeder upper
Technical Library | 2019-05-23 10:30:22.0
Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.
Technical Library | 2019-05-21 17:34:08.0
Flip chip components have been gaining popularity in the electronics industry since their introduction in the 1960s. Advances in attach methods and adhesives, as well as the drive for smaller and faster electronic devices made the technology take off. The basic premise of the flip chip is that the chip (semiconductor device) is mounted flipped from the traditional position. The traditional method of mounting a die is to mount it on a lead frame with the circuit and bond pads face up. The bond pads then receive a bond wire which then connects to the proper lead on the lead frame. Flip chips are mounted face down onto a substrate using small bumps on the bond pads to make direct electrical connection to their respective pads on the substrate. Stay tuned for more information on attachment techniques next month. This article will focus on how to rework flip chips.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS) Recert.
The Certified IPC/WHMA-A-620 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC/WHMA-A-620 Specialist.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Career Center | San Diego, California USA | Engineering
MeltroniX is a supplir of MCM/hybrids for the military and space market. We are seeking a process engineer with expertise in wire bonding, including ultrasonic and thermocompession technology.
Career Center | , British Columbia Canada | Engineering
Looking for an engineer or technician to do some contract work on the assembly, testing, and failure of analysis of microelectronics packagages. The individual needs to understand the process of gold wire bonding and eutectic die attachment. Knowle
Career Center | SanPedro, Philippines | Maintenance,Production
Set-up Equipment machine and ensure its proper operation for costumer satisfaction. Carry out all Proactive Maintenance (PM) tasks such as predictive maintenance, preventative maintenance, failure finding maintenance and calibration maintenan
Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support
Duties & Responsibilities (Equipment Technician): Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment. Conduct Preventive maintenance
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/bonding?con=t&page=3
: Bonding Appliance Nordson DIMA Appliances (or Home Appliances) are electrical and/or mechanical machines which perform household functions, such as cooling, heating, cooking or cleaning
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5495
Wire-Bonding Reliability of Electroless Ni/Pd/Au Plating - Influence of Electroless Pd Deposition Reaction 中文 MEMBERS LOGIN Membership Become a Member
