Industry Directory | Manufacturer
Manufacturer of indium-based specialty metals and chemicals
Industry Directory | Manufacturer
We guarentee to lower your product cost! With over 15 years experience, we are DIRECT CONTACTS of select Asian manufacturing companies and factories from The People's Republic of China, Philippines, and Hong Kong. This select group is well-established manufacturing experts within their industries. We have long term relations with each
Gold / Aluminum / Copper Bonding Wires The bonding wires is the most important material used in making electrical connections between the chip and the external circuit. It has good conductivity and corrosion resistance, and it could be used for extr
New Equipment | Surface Finish
Technic supplies precious metal and tin and tin alloyed products that are used to preserve as well as enhance soldering and bonding through all levels of interconnection. Technic is well established as a leader in Final Finish Solutions for printed
Electronics Forum | Wed Dec 28 16:03:53 EST 2005 | Chris
I have lots of experience with thermosonic gold ball bonding. You can read the literature and you will probably find some papers that say you can do it. I have never been able to do it. We gold ball bond all day long with little problems at all bu
Electronics Forum | Wed Dec 28 21:18:12 EST 2005 | davef
You don't TS bond gold wire to nickel [of ENIG] for the same reason that you don't TS bond gold wire to hard gold. [Nickel or maybe cobalt is used to harden soft gold.] Together nickel and gold produce unreliable bonds. Look here: * http://www.smta.
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Technical Library | 2014-07-24 16:26:34.0
Wire bonding a die to a package has traditionally been performed using either aluminum or gold wire. Gold wire provides the ability to use a ball and stitch process. This technique provides more control over loop height and bond placement. The drawback has been the increasing cost of the gold wire. Lower cost Al wire has been used for wedge-wedge bonds but these are not as versatile for complex package assembly. The use of copper wire for ball-stitch bonding has been proposed and recently implemented in high volume to solve the cost issues with gold. As one would expect, bonding with copper is not as forgiving as with gold mainly due to oxide growth and hardness differences. This paper will examine the common failure mechanisms that one might experience when implementing this new technology.
Technical Library | 2017-09-07 13:56:11.0
As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc Title: Wire Bonding
Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd-Layers SMTnet Express October 11, 2012, Subscribers: 25550, Members: Companies: 9005, Users: 33789 Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/plasma-applications/semiconductor-packaging
. Oxidation can adversely affect die attachment when eutectic solder is used as an adhesive material for die bonding. Wire Bond - Gas plasma technology can be used to plasma clean pads prior to wire bonding to improve bond strengths and yields
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. These sheets are electrically isolated from each other with a layer of non-conductive substrate. PCBs are faster and easier to fabricate than earlier mass-producing circuits since fabricators can mount and wire components in a single operation
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