Manufacturer of thermocouples, thermocouple wire, RTD's, temperature sensors.
Industry Directory | Manufacturer
We offer you the services in working out and manufacture of the widest spectrum of radio-electronic products. Our manufacture is ready to render services in assembly and test of PCB.
New Equipment | Test Equipment
DranTech PMIT Precision Milliohm Insulation Resistance Tester Digital Multimeter and Data Logger All-in-one: Milliohm Resistance Meter, Digital Multimeter, Insulation Resistance Tester and Data Logger Compact and rugged for service applications
Electronics Forum | Mon Apr 16 09:12:23 EDT 2007 | davef
Standard for appearance: J-STD-001 and IPC-A-610 committees eliminated the requirement that solder connections be "bright and shiny". Certain solderability protections; such as Au, NiPd, NiPdAu; can affect the surface texture of a solder connection,
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
Used SMT Equipment | Soldering - Selective
• Dual Pot Lead/Leadfree • Drop Jet Fluxed • Inerted Nitrogen System • One AP Solder tips • PillarCOMM Windows Software • Solder Wire Feeder • Solder Bath Level Sensor • Solder Wave Height Measurement • Black and White Camera Programming • S
Used SMT Equipment | Soldering - Selective
Options: • Less than 100 hours of operation • Top side pre-heat • DC servo drives • Integral PC and machine mounted TFT monitor • Inerted Nitrogen system • Auto motorized wire solder feed & level detect • Solder bath coding – ide
Industry News | 2009-06-16 12:26:28.0
New Five-Day Class Teaches Practical as well as Lecture
Industry News | 2003-04-01 08:13:08.0
The Introbotics equipment boosts controlled impedance testing productivity and accuracy by a factor of ten compared to the handheld probing techniques.
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Parts & Supplies | SMT Equipment
00350533-01 COMP.Magazine long W21,5/H11,1/LE37 00350544-01 RETROFIT KIT COVER CUTTING DEVICE S23 00350588S03 Sleeve with ball fixing compl. DLM1 / 12 00350661S01 O-Ring 10*1 Viton 75 00350662S01 O-Ring 10*1 Viton 75 00350833S01 STRIP MOTOR 12-1
Parts & Supplies | Pick and Place/Feeders
We also supply following Siemens Spare parts : 02101797-01 *SUBSTITUTE= 00313455-01 PLEXIGLASS COVE 02101798-01 REJECT BOX SP-120/SIPLACE 02101903-01 *SUBSTITUTE=303485 TENSION SPRING F.CENT 02101916-01 *SUBSTITUTE=00305676 KLEB-2 PN
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
Technical Library | 2010-08-05 18:39:39.0
Variability analysis is important in successfully deploying multi-gigabit backplane printed wiring boards (PWBs) with growing numbers of high-speed SerDes links. We discuss the need for large sample sizes to obtain accurate variability estimates of SI me
To see more about the Jade MKII Single Point Selective Soldering System visit Pillarhouse USA at: https://www.pillarhouse.co.uk/products/selective-soldering-handload/jade-mkii-handload Entry-level, single point selective soldering system Designed t
00350533-01 COMP.Magazine long W21,5/H11,1/LE37 00350544-01 RETROFIT KIT COVER CUTTING DEVICE S23 00350588S03 Sleeve with ball fixing compl. DLM1 / 12 00350661S01 O-Ring 10*1 Viton 75 00350662S01 O-Ring 10*1 Viton 75 00350833S01 STRIP MOTOR 12-1
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS) Recert.
The Certified IPC/WHMA-A-620 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC/WHMA-A-620 Specialist.
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)
The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.
Events Calendar | Mon Feb 19 00:00:00 EST 2024 - Mon Feb 19 00:00:00 EST 2024 | ,
SMTA Webinar: Development of Wireless Strain Measurement for Printed Circuit Board
Events Calendar | Thu Sep 27 00:00:00 EDT 2018 - Fri Sep 28 00:00:00 EDT 2018 | Lyon, France
IPC/WHMA Cable and Wire Harness Assemblies Conference
Career Center | Meridian, Idaho USA | Engineering
Western Electronics, a high tech contract manufacturing company is currently recruiting for a Process Engineer to assist in integrating new products into production through manufacturing process design and flow. Position responsibilities include:
Career Center | Brooklyn, New York USA | Engineering,Production
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Career Center | Fort Mill, South Carolina USA | Engineering,Maintenance,Research and Development
Have serviced AMF pinspotters both mechanical and electrical sides; included repair of chassis pc boards to component level. 20 years in this field. Have worked in PCB manufacture with old style board populators and Panasert robots Worked in H
Career Center | NEW DELHI, India | Technical Support
I am having almost 20 years of experience in the field of electronics repairs domestic & industrial, able to work on any circuit and PCB without any schematic or diagram. I have all the records and certifications with me and fully c
SMTnet Express May 30, 2013, Subscribers: 26133, Members: Companies: 13389, Users: 34754 Coating Thickness Measurement of Thin Gold and Palladium Coatings on Printed Circuit Boards using X-Ray Fluorescence by: Michael Haller, Volker Rößiger
SMTnet Express, May 4, 2017, Subscribers: 30,444, Companies: 10,591, Users: 23,216 Development of a Consistent and Reliable Thermal Conductivity Measurement Method, Adapted to Typical Composite Materials Used in the PCB Industry Francois
FKN Systek | http://fknsystek.com/Wire%20Crimp.htm
. Tools for measuring the crimp height and the pull out force are also available (see below.) For more precise locating of the crimp contact and wire, a positioning slide is available which allows the loading of the crimp contact and wire
| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_620-CIS.pdf
■ IDEA-STD-1010 Essentials ■ SAE AS5553 Counterfeit Electronics CABLE & WIRE HARNESS TECHNOLOGY Quality & Inspection ■ IPC-A-620 Instructor
