Industry Directory: wire pull test for black pad (1)

SEMICON Sp. z o.o. - Poland

Industry Directory | Consultant / Service Provider / Manufacturer

EMS company Laser SMT stencils mfg Tape converting , slitting , die cut Laser modules mfg Distribution materials,components ISO 9001:2015 ISO 13485:2016 AQAP 2110:2016 EN 9120:2018

Electronics Forum: wire pull test for black pad (24)

ENIG (thru hole ring turns black after wave soldering)

Electronics Forum | Tue Aug 02 15:03:37 EDT 2016 | davef

On a previous black pad experience we soldered a wire to a fiducial and did a pull test to failure. On the black pad board the wire and solder pulled of clean leaving the fiducial on the board. On good boards the copper came off with the wire. If you

Plating for aluminum wire bonding

Electronics Forum | Tue May 13 21:08:24 EDT 2003 | ramanandkini

Dear Sir, Sorry for the delay in reply. This is regarding MIL standard for bond pull strength: MIL-STD-883C dt.25/08/83 Bond strength (destructive bond pull test); refer table-1 Minimum bond strengths for various wire composition & diameter given.

Used SMT Equipment: wire pull test for black pad (1)

Universal Instruments Spare Parts for Thru-hole Inse

Universal Instruments Spare Parts for Thru-hole Inse

Used SMT Equipment | THT Equipment

Spare parts for Universal Radial and Axial through-hole insertion machines Model specifications: (RAD5 6360D, RAD8 6380A, RAD8 XT 6380B, VCD5 6241D, VCD8 6241F, VCD Dual 6292A, SEQ 2596A, SEQ5, SEQ8). UIC Part Number / Part Description 15754 O

Tekmart International Inc.

Industry News: wire pull test for black pad (45)

SMTAI Call for Papers

Industry News | 2009-03-12 18:25:36.0

The SMTA International Technical Committee invites you to submit an abstract for the 2009 conference. Short course descriptions are also being solicited.

Surface Mount Technology Association (SMTA)

New IPC-9708 Standard Fills the Void in Test Methods for Pad Cratering

Industry News | 2011-03-31 11:54:23.0

Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.

Association Connecting Electronics Industries (IPC)

Parts & Supplies: wire pull test for black pad (4)

Universal Instruments UNIVERSAL INSTRUMENTS 30997610 PUSHER

Universal Instruments UNIVERSAL INSTRUMENTS 30997610 PUSHER

Parts & Supplies | Assembly Accessories

UNIVERSAL INSTRUMENTS 30997610 PUSHER Part number: 30997610 Part name:Pusher Brand:Universal Instruments 30997610 PUSHER is a spare parts for Universal instument Insertion Machine, our 30997610 PUSHER with original quality, excellent durabili

ZK Electronic Technology Co., Limited

Universal Instruments 50596801 Guide, Quad Jaw Tall Universal Instruments AI Spare Parts

Universal Instruments 50596801 Guide, Quad Jaw Tall Universal Instruments AI Spare Parts

Parts & Supplies | Assembly Accessories

50596801 Guide, Quad Jaw Tall Universal Instruments AI Spare Parts Part number: 50596801 Part name: Guide, Quad Jaw Tall Brand:Universal Instruments Guide, Quad Jaw Tall is a spare parts for Universal instrument  Insertion Machine, our Guide,

ZK Electronic Technology Co., Limited

Technical Library: wire pull test for black pad (5)

Cold Ball Pull Test Efficiency for the PCB Pad Cratering Validation with the Ultra Low Loss Dielectric Material

Technical Library | 2019-05-08 21:52:28.0

Cold ball pull testing is used to validate the resistance of PCB pad cratering for the different ultra-low loss dielectrics materials (Dk=3~4.2 and Df

iNEMI (International Electronics Manufacturing Initiative)

Numerical Study on New Pin Pull Test for Pad Cratering Of PCB

Technical Library | 2015-02-19 16:54:34.0

Pad cratering is an important failure mode besides crack of solder joint as it’ll pass the regular test but have impact on the long term reliability of the product. A new pin pull test method with solder ball attached and positioning the test board at an angle of 30º is employed to study the strength of pad cratering. This new method clearly reveals the failure mechanism. And a proper way to interpret the finite element analysis (FEA) result is discussed. Impact of pad dimension, width and angle of copper trace on the strength is included. Some findings not included in previous research could help to guide the design for better performance

Flex (Flextronics International)

Videos: wire pull test for black pad (1)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

Videos

ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service

ACI Technologies, Inc.

Events Calendar: wire pull test for black pad (1)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Express Newsletter: wire pull test for black pad (1023)

SMTnet Express - May 9, 2019

SMTnet Express, May 9, 2019, Subscribers: 31,902, Companies: 10,760, Users: 26,083 Cold Ball Pull Test Efficiency for the PCB Pad Cratering Validation with the Ultra Low Loss Dielectric Material Credits: iNEMI (International Electronics

SMTnet Express - August 13, 2015

SMTnet Express, August 13, 2015, Subscribers: 23,186, Members: Companies: 14,558 , Users: 38,745 Pad Cratering Susceptibility Testing with Acoustic Emission Wong Boon San, Julie Silk; Agilent Technologies | Richard Nordstrom, Ph.D.; Acoustic

Partner Websites: wire pull test for black pad (1011)

Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test

Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

Design SMT pad for magnet wire - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/design-smt-pad-for-magnet-wire_topic1206.html

Design SMT pad for magnet wire - PCB Libraries Forum   Forum Home > PCB Footprint Expert > Questions & Answers    New Posts    FAQ    Search    Events    Register    Login Design SMT pad for magnet wire

PCB Libraries, Inc.


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