Microwave Plasma System for assembly cleaning prior to wirebond, attach, encapsulation, and underfill.
Industry Directory | Manufacturer
Contract Manufacturer for MOTOROLA Cellular Transceivers; GWCOM Internet Adapters; K&S WireBonders; Finisar; Hewlett Packard Printers
Aluminum Wirebonding Gold Wirebonding Gold Ribbonbonding Wafer Bumping Flip Chip Packaging BGA LGA SMT Direct Chip Attach System In Package Hybrid MCM Stacked Die 3D Packaging 3D Memory Rad Hard RF Packaging
BGA/SMD Rework & Repair Stations, Selective Soldering Machines, Fume Extraction Equipt., Man. & Semiauto Wirebonders, Man. & Auto SMD Componnent Tape & Reel Machines, Man. & Motorized Parts Counters, Peel Force Testers, X-Ray Equipt.
Electronics Forum | Fri Aug 14 11:01:43 EDT 2020 | charliedci
Looking for someone who can perform die attach, wirebonding and gloptop services on small quantity of SMT assemblies in the US.
Electronics Forum | Thu Oct 08 11:33:16 EDT 2009 | cab
We are currently wirebonding MCMs with surface components located in very close proximity to wirebond pads, which are gold plated. We are ball bonding with 99.99% Au wire. Normally we do not have problems, however if product has been reflowed seve
Used SMT Equipment | AOI / Automated Optical Inspection
Machine Vision Products MVP 850XHD C4 and SMT integrated assembly inspection, surface inspection, wirebond inspection, surface finish inspection
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Used SMT Equipment | Adhesive Dispensers
Asymtek Millennium 600 Epoxy Dispenser For Sale Vintage 1998 Integrated mass flow calibration system automatically compensates for changes in fluid viscosity Full temperature control of fluid delivery with closed-loop substrate heating to
Industry News | 2003-04-17 08:15:33.0
In launching the LA35 series, SMAC reckons it has produced an actuator with unrivalled versatility.
Industry News | 2003-05-22 08:36:27.0
Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
Technical Library | 2014-05-08 16:34:16.0
Bare die mounting on multi-device substrates has been in use in the microelectronics industry since the 1960s. The aerospace industry’s hybrid modules and IBM’s Solid Logic Technology were early implementations that were developed in the 1960’s. The technologies progressed on a steady level until the mid 1990’s when, with the advent of BGA packaging and chip scale packages, the microelectronics industry started a wholesale move to area array packaging. This paper outlines the challenges for both traditional wire-bond die attached to a printed wiring board (pwb), to the more recent applications of bumped die attached to a high performance substrate.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Career Center | Melbourne, Florida USA | Engineering,Production
Mechanical Engineer Candidate will work in the Advanced Manufacturing Technology organization executing the development, qualification, and implementation of leading-edge manufacturing processes across a broad range of applications and support manufa
Career Center | Boulder, Colorado USA | Engineering,Production,Quality Control
Senior-level micro-electronic technician capable of independent manufacture of custom hybrids, focal plane assemblies, and prototype detector assemblies in cleanroom environment (in Advanced Packaging and Detector Laboratory). MINIMUM QUALIFICATIONS
Career Center | , Philippines | Engineering,Technical Support
Electronic manufacturing and Semiconductor equipment programming, sustenance and preventive maintenance. Knowledge in PLC, pneumatics and automated equipment. Desktop, Laptop computer servicing trouble-shooting, repair, hardware and software instal
Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support
Duties & Responsibilities (Equipment Technician): Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment. Conduct Preventive maintenance
