STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets.
Industry Directory | Manufacturer
Manufacturer of materials for the electronics assembly marketplace. Our RoHS-compliant products include solder pastes, fluxes, solder powder, core wire and bar solder and process support products.
New Equipment | Tape and Reel Services
We specialize in 3M advanced technology carrier tapes for small packages such as WLCSP, discrete semiconductor, commercial and military passives and thin film timing devices. We have the industry's broadest selection of 3M carrier tape in stock and
New Equipment | Test Equipment
https://mechanical-devices.com/portfolio-posts/flextc-temperature-forcing-system/ High-Power Temperature Forcing System Ultimate cooling power 70W@-40⁰C/185W@0⁰C From -65⁰C to +175⁰C / 200⁰C A Hi-tech Breakthrough in Fluid Free Operation • Greates
Electronics Forum | Tue Mar 16 18:11:54 EDT 2021 | grahamcooper22
I am wondering, I have an application for assembling a 0.4mm WLCSP to a pcb....the solder sphere size is 0.26mm...would you print paste in the normal printing process and then place the device and reflow...or would you use a fluxing station on the pi
Electronics Forum | Wed Aug 07 22:20:59 EDT 2002 | davef
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John H. Lau; McGraw-Hill Professional Publishing; ISBN: 0071351418; 1st edition (February 8, 2000)
Used SMT Equipment | AOI / Automated Optical Inspection
3D Wafer Bump &Wire Bonding AOI Inspection system Highest quality 3D Wire-Inspection. With high-resolution, complete inspection is possible even for Foot-shape. Inspect Mirror-surface without Reflection problem. As for PEMTRON'S unique optical techn
Industry News | 2018-03-13 18:51:40.0
SMTA is excited to announce the technical program has been finalized and registration is now open for the South East Asia Technical Conference on Electronics Assembly. The event will be held May 8-10, 2018 at the MITEC in Kuala Lumpur, Malaysia.
Industry News | 2003-02-18 09:39:06.0
Encourages You to Submit an Abstract for this Year's Conference
Technical Library | 2012-01-19 19:14:49.0
The history of multilayered, three-dimensional monolithic microwave integrated circuit (3-D MMIC) technology is described here. Although significant researches were carried out in the second half of 1990’s, still there were many twists and turns before an
Technical Library | 2014-04-11 16:03:15.0
In order to meet the increasing demand of device miniaturization, high speed, more memory, more function, low cost, and more flexibility in device design and manufacturing chain, underfilling has increasingly become an essential process for the good reliability of electronic devices. Filled capillary underfill has been selected for use in package-level where there is large thermal stress caused by CTE mismatch issue, but the underfill is usually not reworkable. Unfilled capillary underfill has been used for board-level application such as BGA/CSP, POP, WL-CSP where there is need for mechanical shock resistance, the underfill is usually reworkable.
https://bpmmicro.com/3928-7-site-aps/ The 3928, with up to seven sites, is made for programming large data devices, such as MCUs, eMMC HS400, NAND, NOR and Serial Flash devices. High-speed signals support devices up to 200 Mhz and the latest eMMC
TI New and Original ADS1262IPWR in Stock TSSOP28 package MKE02Z32VFM4 QFN32 NXP 18+ IRS2092S SOP16 INFINEON 22+ VND5160AJTR-E SSOP-12 STM 21+ ZHCS2000TA SOT23-6 DIODES 21+ LTC4267IGN#TRPBF SSOP16 LINEAR 12+ WGI210IT SLJXT QFN64 INTEL 2021
Events Calendar | Tue Jul 17 00:00:00 EDT 2018 - Wed Jul 18 00:00:00 EDT 2018 | ,
Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial
Three-Dimensional MMIC and Its Evolution to WLCSP Technology Three-Dimensional MMIC and Its Evolution to WLCSP Technology by: Tsuneo TOKUMITSU; Sumitomo Electric Industries, Ltd. The history of multilayered, three-dimensional monolithic microwave
Surface Mount Technology Association (SMTA) | https://www.smta.org/southeast-asia/keynotes.cfm
Keynote Speaker | SMTA South East Asia Menu + Conference Program Keynote Exhibition Logistics smta.org Keynote Speaker Recent Advances in Flip Chip, WLCSP, and FOWLP Wednesday, August 15th John H. Lau, Ph.D
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/markets-and-industries/3d-packaging-and-wafer-level-packaging
. Wafer-level packages (WLP) are the molded die components with redistribution layers, called wafer level CSP (WLCSP). This is a packaged component base structure
