New Equipment | Component Programming
Mid America Taping and Reeling, Inc. Offers the fastest programming ic’s services that are performed on state of the art equipment from their 1st suppliers. We specialize in programming memory and logic devices in any quantity and package type. Const
New Equipment | Design Services
Electronic Circuit Design From Concept To Final Product PNC Inc. provides circuit design services for development of conceptual circuit, optimization and selecting appropriate components. We provide analog as well as digital solutions from standalon
Electronics Forum | Thu Jun 17 11:46:33 EDT 2004 | Claude_Couture
Please define "worst case for feeder sizes". Quantity? Arrangement? wasted feeder space?
Electronics Forum | Thu Jun 17 12:31:51 EDT 2004 | cabjerk
Our worst case would be �Quantity�. This info is needed to justify the need for more feeders.
Used SMT Equipment | In-Circuit Testers
Amplifier Research 25W1000M7 RF Amplifier .1-1GHz 25 Watts The Amplifier Research 25W1000M7 is a broadband, solid-state amplifier rated from 100 to 1000 MHz. CW linear power is 20 watts minimum. The 25W1000M7 features instantaneous bandwidth, f
Used SMT Equipment | In-Circuit Testers
Audio Precision SYS-2722A Advanced Audio Test System The Audio Precision’s System SYS-2722 is the newest generation of PC-controlled audio test and measurement instruments. The 2700 series continues to provide the unmatched distortion and noise
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2010-06-11 15:59:00.0
BANNOCKBURN, IL — IPC — Association Connecting Electronics Industries® has released the A revision of IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries. First released in 2008, IPC-9592 sets the requirements for power conversion devices (PCDs) in the computer and telecommunications industries, including design for reliability, design qualification testing, manufacturing conformance testing and quality processes.
Technical Library | 2012-09-20 21:45:38.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturin
Technical Library | 2021-11-22 20:39:44.0
Quality control is a key activity performed by manufacturing companies to verify product conformance to the requirements and specifications. Standardized quality control ensures that all the products are evaluated under the same criteria. The decreased cost of sensors and connectivity enabled an increasing digitalization of manufacturing and provided greater data availability. Such data availability has spurred the development of artificial intelligence models, which allow higher degrees of automation and reduced bias when inspecting the products. Furthermore, the increased speed of inspection reduces overall costs and time required for defect inspection. In this research, we compare five streaming machine learning algorithms applied to visual defect inspection with real world data provided by Philips Consumer Lifestyle BV. Furthermore, we compare them in a streaming active learning context, which reduces the data labeling effort in a real-world context. Our results show that active learning reduces the data labeling effort by almost 15% on average for the worst case, while keeping an acceptable classification performance. The use of machine learning models for automated visual inspection are expected to speed up the quality inspection up to 40%.
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Career Center | Manila, Philippines | Engineering
I am an experienced Electronics Engineer which is capable in electronics circuit design, trouble shooting and debugging. Have been involved in an R and D environment for 10 years which focus on the designing of power electronics circuit. Currently ho
Career Center | Manila, Philippines | Engineering
I am an experienced Electronics Engineer which is capable in electronics circuit design, trouble shooting and debugging. Have been involved in an R and D environment for 10 years which focus on the designing of power electronics circuit. Currently ho
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2813&OB=ASC.html
. The Chip package height cannot be the primary factor in establishing the Toe solder joint goal. You must take the worst case scenario and work backwards to figure out a single Toe goal for a specific package size
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/our-company/news-room/feature-content-roll-up-page/german-students-send-balloon-into-space-with-help-from-nordson
. "But it was the worst case scenario!" Computer science teacher Ralph Carrie said. "The GPS tracker must have failed during the flight and made finding the probe impossible
winsouce.jpg)
