New Equipment | Solder Materials
As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr
Electronics Forum | Wed Nov 23 15:02:38 EST 2005 | tglenn
We are using AIM WS300 solder paste and are experiencing excessive voiding on our BGAs. We have exhausted reflow profile alternatives and just can't beat the voids. Has anyone had success with this paste on BGAs? If so how?
Electronics Forum | Sun Mar 31 22:50:28 EST 2002 | ianchan
Nope, we do not have solder beads, like we said, what we have are near perfect solder fillets except for the portion where the component is "floating OFF" the pcb pads. We are now mucking through the IPC-A-610C for specifications dictation on "tilted
| http://www.thebranfordgroup.com/dnn3/Employees/OnlineAuctionAdmin/Concept2Market,Inc/tabid/1906/AuctionID/1640/Default.aspx?page=4
: 162 Impulse Sealer for Polybags Model AIE-300 C Sold at Concept 2 Market, Inc. on 3/21/2023 Pompano Beach FL Previous Item Next Item Lot Number: 162 Description
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
(Figure 9). The solder paste was Alpha tin/lead solder alloy WS- 609. The components were placed using the Universal Advantis machine. Figure 9. MPM Stencil Printer The test vehicle was reflowed in a Heller 1912EXL Convection Reflow Oven. This oven had 14
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