Electronics Forum | Mon Jan 21 11:12:20 EST 2008 | davef
Just what is delaminationg during testing? Water washing should be sufficient to clean WS609. On the other hand, it's possible you're conveyor speed is too high to do a good job cleaning the high density areas. What kind of testing have you done to
Electronics Forum | Mon Jan 21 16:13:50 EST 2008 | arun2382
We see delamination at Mold compound to substrate interface when tested for MSL3. We haven't tested the substrate for cleanliness. Can you please suggest methods for this? thanks, arun
Heller Industries Inc. | https://hellerindustries.com/browse/page/258/
, 4.75 IMP, N2, W/Teflon, MK3.6 439932---Cover of top shell, Flux Jar 440094---Cover, Flux cup 440262---EMPR(ELECTRONIC MOTOR PROTECTI 440271---FLOWMETER(PFM511S-02-1-WS
40731 | https://www.smta.org/harsh/Harsh-Environments-Conference-Program-2020.pdf
Surface Mount Technology Association (SMTA)
