Electronics Forum | Sun Apr 05 18:36:41 EDT 1998 | Graham Naisbitt
Sylvia, I believe you will find that contrary to Scott Cooks submission, that the work carried out by Robert Clark of Hughes Missile Systems at (then) Tuscon Arizona formed the basis of the MIL-F-14256 spec which "Qualified?" or at least "Approved" O
Electronics Forum | Thu Apr 04 05:33:19 EST 2002 | ianchan
Hi, hope this helps : 1) BCC (bump chip carrier) production for us, was with a 5mils Stencil. The outer perimeter smallish pads are not much of a problems. For the central large pad, we split the paste print (corresponds to the Stencil apperture op
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