Industry Directory | Manufacturer
PCB Assembly (SMT, Through-hole, BGA, Automatic, Manual, X-Ray, Selective Soldering); Cable Harnessing; Server Integration/Configuration; NUC Integration/Configuration; Touch-Screen Integration; Repairs and RMA services
Industry Directory | Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative / Training Provider
Largest Universal Instruments, Europlacer and Speedprint full service and stocking operation in the industry. Plus many other brands as we install complete turn key SMT lines new and used with full production launch and training.
New Equipment | Assembly Services
SMT Xtra offers a comprehensive range of quality pre-owned SMT and PTH equipment at competitive prices to suit all requirements and budgets... Smt Xtra is backed by the HSBC bank enabling us to offer customers easy payment terms with extended payme
New Equipment | Assembly Services
PCB Assembly Quickturn and Prototype PCB Assembly. That's what you need, that's what we do. We can support small engineering projects up to full turn-key, medium volume production. With in-house process verification tools like AOI, Xray and Ersas
Electronics Forum | Tue Jan 05 16:36:46 EST 1999 | Leyanis Guevara
I would like comments from users about X-rays manufactured by Lixi Inc and Gleenbrook Technologies. Quality of product, servicing, ease of operation etc. We are currently looking into justification for such a product (table top) our next step is RBA
Electronics Forum | Wed Jan 06 10:51:33 EST 1999 | Scott McKee
| I would like comments from users about X-rays manufactured by Lixi Inc and Gleenbrook Technologies. Quality of product, servicing, ease of operation etc. | | We are currently looking into justification for such a product (table top) our next step
Used SMT Equipment | X-Ray Inspection
This equipment is located in our upcoming Nypro / Jabil Online Auction. Please select the below link for more details. http://bajabid.com/online-smt-auction-featuring-items-nypro/
Used SMT Equipment | X-Ray Inspection
This item is being sold to the highest bidder in the September 23-26, 2019 Online SMT Auction. Please select the following link for more details on this item and this sale. https://bajabid.hibid.com/catalog/182060/september-2019-auction/
Industry News | 2003-02-06 08:28:24.0
Will Premiere Its 2002 Roadmap at IPC SMEMA Council�s APEX Conference in Anaheim, CA, March 31-April 2
Industry News | 2003-05-22 08:54:17.0
Allows PCA Manufacturers to Compare Costs of Alternative Test Strategies
Technical Library | 2013-02-08 22:56:47.0
Solder voiding is present in the majority solder joints and is generally accepted when the voids are small and the total void content is minimal. X-ray methods are the predominate method for solder void analysis but this method can be quite subjective for non grid array components due to the two dimensional aspects of X-ray images and software limitations. A novel method of making a copper "sandwich" to simulate under lead and under component environs during reflow has been developed and is discussed in detail. This method has enabled quantitative solder paste void analysis for lead free and specialty paste development and process refinement. Profile and paste storage effects on voiding are discussed. Additionally an optimal design and material selection from a solder void standpoint for a heat spreader on a BCC (Bumpered Chip Carrier) has been developed and is discussed.
Technical Library | 2021-11-03 17:05:39.0
Additively printed circuits provide advantages in reduced waste, rapid prototyping, and versatile flexible substrate choices relative to conventional circuit printing. Copper (Cu) based inks along with intense pulsed light (IPL) sintering can be used in additive circuit printing. However, IPL sintered Cu typically suffer from poor solderability due to high roughness and porosity. To address this, hybrid Cu ink which consists of Cu precursor/nanoparticle was formulated to seed Cu species and fill voids in the sintered structure. Nickel (Ni) electroplating was utilized to further improve surface solderability. Simulations were performed at various electroplating conditions and Cu cathode surface roughness using the multi-physics finite element method. By utilizing a mask during IPL sintering, conductivity was induced in exposed regions; this was utilized to achieve selective Ni-electroplating. Surface morphology and cross section analysis of the electrodes were observed through scanning electron microscopy and a 3D optical profilometer. Energy dispersive X-ray spectroscopy analysis was conducted to investigate changes in surface compositions. ASTM D3359 adhesion testing was performed to examine the adhesion between the electrode and substrate. Solder-electrode shear tests were investigated with a tensile tester to observe the shear strength between solder and electrodes. By utilizing Cu precursors and novel multifaceted approach of IPL sintering, a robust and solderable Ni electroplated conductive Cu printed electrode was achieved.
This video describes the J-STD-001 solder certification program. It is an overview of the program, the certification requirements and the types of credentials. For More Information On IPC J-STD-001 Training Visit Our Website: IPC J-STD-001 CIT Cert
The TruView Fusion X is a revolutionary x-ray inspection system capable of inspecting large boards - up to 20"x48". Ideal for LED panles and luminaires void inspection and quality assurance of backpanel assemblies.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon May 04 00:00:00 EDT 2020 - Mon May 04 00:00:00 EDT 2020 | ,
Ball Grid Array Rework - How to Do It Successfully
Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,
Webinar: BGA and Area Array Process Defects - Causes & Cures
Career Center | Novi, Michigan USA | Maintenance
Essential Responsibilities: Coordinates prototype builds in the Pilot Factory while keeping an eye on design for manufacturability issues. Ability to troubleshoot equipment and process issues. Responsible for full support equipment on Pilot Factor
Career Center | Seymour, Connecticut USA | Engineering
Develop and manage SMT assembly and soldering processes and associated staff in medium volume/high-mix printed circuit board assembly operation for complex quality class 2/3 assemblies. DUTIES AND RESPONSIBILITIES: Plan and develop processes a
Career Center | Warminster, Pennsylvania USA | Management,Production
Process Engineering -Programmed, operated and maintained all automated assembly equipment (SMT, Selective Solder, conformal Coating) -Write procedures for above operation and maintenance. -Create and maintain all work instructions -Write ISO procedur
Career Center | Wayland, Michigan USA | Engineering,Maintenance,Research and Development,Technical Support
-Young, energetic, and eager individual ready and willing to learn new skills and exercise my current skill set. -Trained and proficient in the following pieces of equipment: MyData Pick and Place, Dek screen printers, Cyberoptic and Koh Young SPI,
endoscopic technology and X-ray imaging adds a greater d
| https://www.smtfactory.com/AXI-Automatic-X-Ray-Inspection-pl3345132.html
AXI / Automatic X-Ray Inspection from China, AXI / Automatic X-Ray Inspection Manufacturer & Supplier - I.C.T SMT Machine English Bahasa indonesia Сербия
Baja Bid | https://bajabid.com/product-category/x-ray/
X-Ray Archives - Baja Bid LLC Skip to content Your EMS Asset Management Partner Careers | Current Auctions Linkedin page opens in new window Baja Bid LLC Your EMS Asset Management Partner Home About Services Managed Online Auctions Asset Analysis Consignment Program Cash Buyout Program
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