Industry Directory | Equipment Dealer / Broker / Auctions
BAJA Bid was founded to form an auction organization with the primary objective of providing an outstanding experience for both our buyers and sellers.
Industry Directory | Standards Setting / Certification / Training Provider / Consultant / Service Provider / Manufacturer
BEST is a certified master IPC Training and Solder Certification center. We provide comprehensive courses for both Instructors and Operators including IPC-A-610, IPC J-STD-001, IPC-A-600, IPC/WHMA-A-620, and IPC 7711/7721 standard
New Equipment | Assembly Services
If you are an EMS provider or OEM of electronic/electrical components or sub-assemblies incorporating plastics, metals, ceramics or any combination of these, BEST Inc can offer you knowledgeablePCB x-ray inspection services. BEST experiences in thes
New Equipment | Assembly Services
BEST can provide you with analysis services for your BGAs using x-ray equipment. We rework thousands of BGAs and POPs every year, therefore, we have the expertise in BGA X-ray inspection. BEST can be your outsourced BGA x-ray inspection source for o
Used SMT Equipment | X-Ray Inspection
Focal Spot Inc, x-Ray Station, Model FSX-960, MFG: Dec 2005, Located In Fremont, CA An auction item: bidding on this listing starts on Wednesday, September 20, 2017 6:00:00 AM
Used SMT Equipment | X-Ray Inspection
2010 Nordson DAGE XD7500NT Xray Make: Nordson DAGE Model: XD7500NT Vintage: 2010 Description: Xray Condition: Complete & Operational Location: FL, USA Availability: Immediate Shipping: EXW Origin Terms: 100% Prepay Please contact us directly with any
Industry News | 2003-03-11 08:16:17.0
Lightspeed has already shipped its first product, and has set up production in a new building with up to date facilities and equipment.
Industry News | 2016-10-25 09:47:33.0
Learn about SMT assembly from SME Phil Zarrow in Chicago
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
BGA integrated circuits and chip scale packages, CSPs where the solder connections are not visible. This has arisen as a result of the need for greater numbers of interconnections to integrated circuit packages and as a general result of increasing c
Training Courses | ON DEMAND | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | ON DEMAND | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Mon Jun 14 18:30:00 UTC 2021 - Mon Jun 14 18:30:00 UTC 2021 | ,
Webinar: How to Improve Defect Identification from an X-ray Inspection System
Events Calendar | Wed Feb 14 18:30:00 UTC 2024 - Wed Feb 14 18:30:00 UTC 2024 | Dayton, Ohio USA
Ohio Valley In-Person Technical Meeting: Extracting Value from SPI, AOI and X-Ray Technologies
Career Center | , | Engineering,Sales/Marketing,Technical Support
T. H. Bender & Partners is a retained executive search firm; we have been engaged by a highly successfull and fast growing manufacturer of x-ray inspection equipment to help them to hire two Senior Sales and Service Engineers. Job Summary - This Sen
Career Center | Madison, Alabama USA | Engineering,Production
Performs electronic assembly functions on an as needed basis. Performs rework/replacement/placement operations on BGAs using various rework systems without doing damage to the assemblies. Performs X-ray inspection of BGAs using CRX-2000 real time
Career Center | Upton, New York USA | Engineering,Production,Research and Development
Experienced in x-ray reflectrometry and diffraction characterization of semiconductor layered materials, wavelength dispersive x-ray spectroscopy analysis of materials, x-ray scattering analysis of thin films surface and interface Experienced in d
Career Center | Royal Oak, Michigan USA | Engineering
I have worked in various positions in the SMT assembly process for 7 years. In-line process setup, troubleshooting and programming of various equipment. Very familiar with Fuji, Universal, MPM and 5DX X-ray inspection machines.
endoscopic technology and X-ray imaging adds a greater d
Baja Bid | https://bajabid.com/product-tag/xray/
Xray Archives - Baja Bid LLC Skip to content Your EMS Asset Management Partner Careers | Current Auctions Linkedin page opens in new window Baja Bid LLC Your EMS Asset Management Partner Home About Services Managed Online Auctions Asset Analysis Consignment Program Cash Buyout Program
Lewis & Clark | http://www.lewis-clark.com/product-tag/xray/
xray Archives - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart. Subtotal: View Cart Checkout Lewis and Clark We Discover Equipment Opportunities NH: 603-594-4229 FL: 813-888-7436 sales@lewis
BAJA Bid was founded to form an auction organization with the primary objective of providing an outstanding experience for both our buyers and sellers.
Equipment Dealer / Broker / Auctions
13227 Royal George Avenue
Odessa, FL USA
Phone: 813-992-2437
