Industry Directory | Consultant / Service Provider
Tebo ICT ATE FCT MDA test fixture Probe GC-PowerStation Testway Unisoft valor Trilogy-5000 UGS-Tecnomatix ODBinside Cadence CAMCAD IDF4.0 ECAD Strain-Gauge FEA BSA Board-Stress-Analysis CircuitWor
Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer
Electronic Test Engineering Services
New Equipment | Assembly Services
If you are an EMS provider or OEM of electronic/electrical components or sub-assemblies incorporating plastics, metals, ceramics or any combination of these, BEST Inc can offer you knowledgeablePCB x-ray inspection services. BEST experiences in thes
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
Used SMT Equipment | Pick and Place/Feeders
PEMTRON SPI TROI-7700HD Technology & Features: Dual Projection Combination of 2D & 3D inspection eliminates common shadow problem with SPI systems. 64 bit Windows 7 Operation System Fast & Stable Operating System for high density PCB.
Used SMT Equipment | Pick and Place/Feeders
FX-3RAL High-Speed Modular Mounter ■ Chip components 90,000CPH (0.040 seconds/chip, good conditions) 66,000CPH: Chip (according to IPC9850 standard) ■ 0402 chip～33.5mm square element ■ Laser recognition: ±0.05mm
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Industry News | 2013-01-16 19:22:48.0
GPD Global will exhibit in Booth #2633 at the upcoming IPC APEX EXPO. Live demonstrations will be given for a number of systems from the company's dispensing line.
Technical Library | 2018-01-04 11:05:34.0
Traceability has grown from being a specialized need for certain safety critical segments of the industry, to now being a recognized value-add tool for the industry as a whole. The perception of traceability data collection however persists as being a burden that may provide value only when the most rare and disastrous of events take place. Disparate standards have evolved in the industry, mainly dictated by large OEM companies in the market create confusion, as a multitude of requirements and definitions proliferate. The intent of the IPC-1782 project is to bring the whole principle and perception of traceability up to date. Traceability, as defined in this standard will represent the most effective quality tool available, becoming an intrinsic part of best practice operations, with the encouragement of automated data collection from existing manufacturing systems, integrating quality, reliability, predictive (routine, preventative, and corrective) maintenance, throughput, manufacturing, engineering and supply-chain data, reducing cost of ownership as well as ensuring timeliness and accuracy all the way from a finished product back through to the initial materials and granular attributes about the processes along the way.
Technical Library | 2014-08-19 15:39:13.0
Understanding warpage of package attach locations on PCBs under reflow temperature conditions is critical in surface mount technology. A new industry standard, IPC 9641, addresses this topic directly for the first time as an international standard.This paper begins by summarizing the sections of the IPC 9641 standard, including, measurement equipment selection, test setup and methodology, and accuracy verification. The paper goes further to discuss practical implementation of the IPC 9641 standards. Key advantages and disadvantages between available warpage measurement methods are highlighted. Choosing the correct measurement technique depends on requirements for warpage resolution, data density, measurement volume, and data correlation. From industry experience, best practice recommendations are made on warpage management of PCB land areas, covering how to setup, run, analyze, and report on local area PCB warpage.The release of IPC 9641 shows that flatness over temperature of the package land area on the PCB is critical to the SMT industry. Furthermore, compatibility of shapes between attaching surfaces in SMT, like a package and PCB, will be critical to product yield and quality in years to come.
BGA integrated circuits and chip scale packages, CSPs where the solder connections are not visible. This has arisen as a result of the need for greater numbers of interconnections to integrated circuit packages and as a general result of increasing c
EZReball demonstration video. Simple and Fast new reball method! The new BEST EZReball™ process is an answer to your reballing problems. This unique method simplifies the reballing process allowing for better yields and faster reballing times. http:
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Tue Jul 18 18:30:00 UTC 2023 - Tue Jul 18 18:30:00 UTC 2023 | ,
SMTA Webinar: Secure, Intelligent, Detailed Design Data Exchange Between Design & Manufacturing
Events Calendar | Wed Apr 07 18:30:00 UTC 2021 - Wed Apr 07 18:30:00 UTC 2021 | ,
Webinar: The IPC Digital Twin Standard
Career Center | , | 2017-11-02 10:24:18.0
Responsible for construction of prototype circuits/controls, troubleshooting electrical issues and conducting testing to verify electronic design. From schematics, assemble prototype circuits and/or controls to prove out design concepts. Working
Career Center | , | 2017-11-02 10:26:03.0
Responsible for construction of prototype circuits/controls, troubleshooting electrical issues and conducting testing to verify electronic design. From schematics, assemble prototype circuits and/or controls to prove out design concepts. Working
Career Center | Clearwater, Florida USA | Maintenance,Production,Quality Control,Technical Support
I have approximately 14 years experience in the Electronics manufacturing industry. I have experience from manual assembly to machine technical support for SMT eqiupment. I also have some experience with AI equipment. I have Automatic Optical Inspect
Career Center | Thane, INDIA India | Maintenance,Production,Technical Support
Experience: 12 years relevant work experience in repotted electronic manufacturing industries that includes Data Communications, Consumer Electronics and PC Manufacturing Industry. Work experience in Engineering process and Quality Control. Technica
SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page << Back to Page 4 2. Numerical Data: This display of values allows the user to see
SMT Express, Volume 5, Issue No. 3 - from SMTnet.com Return to Front Page << Back to Page 4 2. Numerical Data: This display of values allows the user to see and analyze the numeric results of the measurement. Fig. 17: Numerical
| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_IPCDesigner_CID.pdf
“Generic Standard on Printed Board Design” and IPC-2222 “Sectional Design Standard for Rigid Organic Printed Boards”. The program covers guidance and requirements for printed board assembly and design parameters from component mounting, inter- connecting structures, conductor characteristics, surface finishes, board
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/mr-louis-lin-from-nordson-dage-to-present-at-ipc-southeast-asia-high-reliability-conference
Mr Louis Lin from Nordson DAGE to Present at IPC Southeast Asia High Reliability Conference X-Ray Inspection and Test Products Corporate | Global Directory
