Used SMT Equipment | Pick and Place/Feeders
Name:YV88Xg middle speed multifunctional Chip mounter Placement Speed: Chips :6500cph(0.55sec/chip) QFPs:4000CPH(0.9sec /QFP) Placement Range:0.6X0.3mm~□54mm or 100x45mm Placement Station:100 Power Supply:3P/200V-416V/KVA Dimensi
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Used SMT Equipment | Pick and Place/Feeders
Name:YV88Xg middle speed multifunctional Chip mounter Placement Speed: Chips :6500cph(0.55sec/chip) QFPs:4000CPH(0.9sec /QFP) Placement Range:0.6X0.3mm~□54mm or 100x45mm Placement Station:100 Power Supply:3P/200V-416V/KVA Dimensi
SMTnet Express, September 24, 2015, Subscribers: 23,507, Members: Companies: 14,658, Users: 39,014 Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices Dick Pang, Weifeng Liu, Anwar Mohammed, Elissa Mckay, Teresita Villavert and Murad
