Electronics Forum | Mon Sep 09 21:42:12 EDT 2002 | rwilliams
I have been involved with the reflow process for many years. However, my most recent position now includes the use of Nitrogen. In studying the reflow process and using Nitrogen, it seems to me that it would only make sense to be measuring the O2 lev
Electronics Forum | Sat Nov 05 20:23:11 EDT 2016 | sarason
Close but not to close, would have to be the spec. Or depends on your separating technology. Prerouted boards on a panel, you could go right up to the edge. V-grove you will need more distance, maybe 2mm's or more. The distance from the panel edge to
Industry News | 2023-08-12 13:48:10.0
In the SMT production process, considering the importance of the mounting speed of the SMT machine, many SMT machine manufacturers are making every effort to improve the speed of the SMT machine. KINGSUN technical team has analyzed the following main methods to improve the speed of the SMT machine:
Industry News | 2017-06-29 18:13:27.0
IPC – Association Connecting Electronics Industries® announces the launch of Pulse of the Electronics Industry, a new global data service that promises to generate valuable forward-looking data for the electronics industry. Developed in response to requests from IPC members, this service will provide timely insights on the current health of the industry and its future outlook.
Technical Library | 2020-12-29 20:55:46.0
Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. Solder paste flux, solder powder size, stencil design, circuit board design, via-in-pad design, surface finish, component size, reflow profile, vacuum reflow, nitrogen reflow and other parameters have been varied and voiding quantified for each. The results show some differences in voiding performance with respect to most of these variables but these variables are not independent of each other. Voiding in solder joints is a complex issue that often requires multiple approaches to reduce voiding below required limits. This paper focuses on solutions to voiding for commonly used bottom terminated components (BTCs).
Watch CyberOptics' CX150i Automated Conformal Coating Inspection System in action. The CX150i offers fast and accurate conformal coating defect detection critical for long-term PCB reliability. It not only speeds up inspection but also reduces labor
Imagineering, Inc. | https://www.pcbnet.com/blog/future-printed-circuit-boards-trends-to-watch-for/
The Future of Printed Circuit Boards: Trends and Innovations to Watch Out For | Imagineering, Inc. Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
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