Industry Directory | Manufacturer
Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.
(Albany, NY) December 22, 2017 – The DA 150 series materials are YINCAE’s new fast curing die attach adhesives. The DA 150 series offers conductive and insulating options to suit a large variety of applications. These products can be cured quickly at
YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA (Albany, NY) 10/20/2017 – YINCAE Advanced Materials has recently developed a unique amine based high purity liquid epoxy encapsulant: SMT 158HA. SMT 158HA is a slow cure underfill particularl
Industry News | 2022-10-20 07:09:49.0
The Women's Leadership Program (WLP), an SMTA-sponsored organization that strives to promote diversity and inclusion in engineering and manufacturing fields, announces that it will host a Speed Mentoring Session on Tuesday, November 1, 2022 during SMTA International.
Industry News | 2016-02-15 20:06:55.0
New opportunities and answers to industry challenges will abound as leaders in the electronics manufacturing industry debut cutting-edge products and services at IPC APEX EXPO®, March, 15–17, 2016, at the Las Vegas Convention Center. In keeping with the event’s theme, “Forward Thinking for Tomorrow’s Technology,” a significant number of exhibitors will be introducing new products at the show. Exhibitors will also feature chemicals, materials, and equipment for PCB manufacturing, as well as design software and printed electronics.
Technical Library | 2016-01-12 11:04:35.0
3D packaging has recently become very attractive because it can provide more flexibility in device design and supply chain, reduce the gap between silicon die and organic substrate, help miniaturize devices and meet the demand of high speed, provide more memory, more function and low cost. With the advancement of 3D packaging, the bump height is now down from 80μ to 10μ. When the bump diameter is 20-40μ and height 10μ, the process and reliability are obvious issues. It is well known that underfill can enhance the reliability for regular flip chip, however underfill won’t help assembly process. In order to resolve some difficulties that 3D packaging faces, YINCAE Advanced Materials, LLC has developed solderable anisotropic conductive adhesives for 3D package applications. In this paper we will discuss the assembly process and reliability in detail.
Technical Library | 2016-11-17 14:37:41.0
With increasing LED development and production, thermal issues are becoming more and more important for LED devices, particularly true for high power LED and also for other high power devices. In order to dissipate the heat from the device efficiently, Au80Sn20 alloy is being used in the industry now. However there are a few drawbacks for Au80Sn20 process: (1) higher soldering temperature, usually higher than 320°C; (2) low process yield; (3) too expensive. In order to overcome the shortcomings of Au80Sn20 process, YINCAE Advanced Materials, LLC has invented a new solderable adhesive – TM 230. Solderable adhesives are epoxy based silver adhesives. During the die attach reflow process, the solder material on silver can solder silver together, and die with pad together. After soldering, epoxy can encapsulate the soldered interface, so that the thermal conductivity can be as high as 58 W/mk. In comparison to Au80Sn20 reflow process, the solderable adhesive has the following advantages: (1) low process temperature – reflow peak temperature of 230°C; (2) high process yield – mass reflow process instead of thermal compression bonding process; (3) low cost ownership. In this paper we are going to present the die attach process of solderable adhesive and the reliability test. After 1000 h lighting of LED, it has been found that there is almost no decay in the light intensity by using solderable adhesive – TM 230.
(Albany, NY) 1/2/2018 – YINCAE Advanced Materials has recently developed a reflowable (no flow) underfill: SMT 160. This product is designed to eliminate capillary underfills, simplify the assembly process, combine soldering and underfilling in SMT p
Filled Fluxing Underfill Product
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Mon Sep 29 18:30:00 UTC 2025 - Tue Sep 30 18:30:00 UTC 2025 | San Diego, California USA
YINCAE Showcases High-Performance Materials at IMAPS 2025
Career Center | Albany, New York USA | Technical Support
YINCAE Advanced Materials, LLC. is looking for a highly motivated Technical Engineer. The ideal applicant will be self-directed, well organized, articulate, and a team player. The Technical Engineer will work closely with our Enterprise customers to
Career Center | Albany, New York USA | Sales/Marketing
YINCAE Advanced Materials is a leading manufacturer and supplier of adhesives and electronic materials used in the microchip and optoelectronic field. As our customer base and business expand, We are seeking more Technical Sales Engineers to join our
SMTnet Express, January 14, 2016, Subscribers: 23,987, Members: Companies: 14,894, Users: 39,724 The Future of Solder Joint Encapsulant Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced Materials, LLC. Solder joint encapsulant adhesives have been
The Future of Solder Joint Encapsulant Online Version SMTnet Express, January 14, 2016, Subscribers: 23,987, Members: Companies: 14,894, Users: 39,724 The Future of Solder Joint Encapsulant Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced
Surface Mount Technology Association (SMTA) | https://www.smta.org/panpac/Pan-Pacific-2020-Program.pdf?v=20060405647
:00AM - 11:45AM Lehua/Hau 11:45AM - 12:45PM Breezeway Session 3- Reliability Chair: *Michael Konrad, Aqueous Technologies Session 4- Advanced Materials Chair
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) American Precision Electronics Incorporated (A.P.E.)* AMETEK Programmable Power Corporation AMI Incorporated AMMROC (Advanced Military Maintenance Repair and Overhaul Center) LLC
