New SMT Equipment: zarrow weight to solder surface area (210)

3D SPI-7500 solder paste thickness gauge

3D SPI-7500 solder paste thickness gauge

New Equipment | Assembly Services

Detailed introduction of 3D spi-7500 solder paste thickness gauge  Product function Fast programming, friendly programming interface 1. Multiple measurement methods 2. True one button measurement 3. Eight square movement button, one key foc

KingFei SMT Tech

Stainless steel material PCBA surface conformal coating automatic removing machine

New Equipment | Cleaning Equipment

Automatic off line PCBA Cleaning machine China manufacturer Features: 1. A comprehensive cleaning system: the surface of the product residues of organic matter, inorganic substances for thorough and effective cleaning; 2. Automatic cleaning mode

Shenzhen Honreal Technology Co.,Ltd

Electronics Forum: zarrow weight to solder surface area (64)

Re: Solder surface tension

Electronics Forum | Tue Oct 12 05:09:13 EDT 1999 | Brian

| | | | | | | Can anyone tell me the formula/method to determine | | | | | | | the amount of weight that solder's surface tension can support. | | | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | | | of a board during

Re: Solder surface tension

Electronics Forum | Mon Oct 11 12:49:11 EDT 1999 | John Thorup

| | | | | | Can anyone tell me the formula/method to determine | | | | | | the amount of weight that solder's surface tension can support. | | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | | of a board during a top s

Used SMT Equipment: zarrow weight to solder surface area (4)

ASC International ASCII paste thickener, 3D SPI-6500 paste thickener

ASC International ASCII paste thickener, 3D SPI-6500 paste thickener

Used SMT Equipment | Pick and Place/Feeders

Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser

KingFei SMT Tech

ASC International VisionPro M500 3D Solder Paste Inspection System (2019)

ASC International VisionPro M500 3D Solder Paste Inspection System (2019)

Used SMT Equipment | SPI / Solder Paste Inspection

ASC VisionPro M500 3D Solder Paste Inspection System (2019) Brand: ASC InternationalModel: M500 3D Solder Paste Inspection SystemS/N: PSI-107Year: 2019Software: ASCan ULTRA Version 2.4.4.5O/S: Windows 10 Pro System SpecificationsMaximum Object Thickn

Tekmart International Inc.

Industry News: zarrow weight to solder surface area (174)

Phil Zarrow, ITM Consulting, to Present at SMTA Capital Chapter Tutorial Program

Industry News | 2018-02-07 17:52:33.0

The SMTA Capital Chapter is pleased to announce that it will host a Chapter Tutorial Program on March 15th from 9AM to 3PM in Rockville, MD. Phil Zarrow, ITM consulting, will present “Understanding and Implementing Best Practices in Electronic Assembly Processes”.

Surface Mount Technology Association (SMTA)

SMTA Capital Chapter to Host Chapter Tutorial Program

Industry News | 2018-02-19 13:59:23.0

The SMTA Capital Chapter is pleased to announce that it will host a Chapter Tutorial Program on March 15th from 9AM to 3PM in Rockville, MD. Phil Zarrow, ITM consulting, will present “Understanding and Implementing Best Practices in Electronic Assembly Processes”.

Surface Mount Technology Association (SMTA)

Parts & Supplies: zarrow weight to solder surface area (1)

Other SMT-2010

Other SMT-2010

Parts & Supplies | Soldering - Reflow

Brand New SMT2010 TABLE-TOP REFLOW OVEN LEAD-FREE Description: This is a brand new, SMT2010 Reflow oven. More and more surface mount devices (SMD) are used on electronic circuit boards. Large floor model reflow ovens are expensive and heavy, no

SMTmax

Technical Library: zarrow weight to solder surface area (3)

Cleaning No-Clean Fluxes Prior to Conformal Coating

Technical Library | 2020-03-09 10:50:17.0

A customer called the Helpline seeking advice for cleaning no-clean fluxes prior to applying a conformal coating. The customer's assemblies were manufactured with a no-clean rosin based solder paste (ROL0) and were cleaned with an isopropyl alcohol (IPA) wash. After cleaning, a white residue was sometimes found in areas with high paste concentrations and was interfering with the adhesion of the conformal coating (Figure 1). For conformal coatings to adhere properly, the printed circuit board (PCB) surface must be clean of fluxes and other residues. In addition, ionic contamination left by flux residues can lead to corrosion and dendrite growth, two common causes of electronic opens and shorts. Other residues can lead to unwanted impedance and physical interference with moving parts.

ACI Technologies, Inc.

Analysis of Laminate Material Properties for Correlation to Pad Cratering

Technical Library | 2016-10-20 18:13:34.0

Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed circuit board tend to fracture under ball grid array pads when subjected to high strain mechanical loads. In this study, two Pb-free-compatible laminates were tested, plus one dicycure non-Pb-free-compatible as control. One set of these samples were as-received and another was subjected to five reflows. It is assumed that mechanical properties of different materials have an influence on the susceptibility of laminates to fracture. However, the pad cratering phenomenon occurs at the layer of resin between the exterior copper and the first glass in the weave. Bulk mechanical properties have not been a good indicator of pad crater susceptibility. In this study, mechanical characterization of hardness and Young’s modulus was carried out in the critical area where pad cratering occurs using nano-indentation at the surface and in a cross-section. The measurements show higher modulus and hardness in the Pb-free compatible laminates than in the dicy-cured laminate. Few changes are seen after reflow – which is known to have an effect -- indicating that these properties do not provide a complete prediction. Measurements of the copper pad showed significant material property changes after reflow.

CALCE Center for Advanced Life Cycle Engineering

Videos: zarrow weight to solder surface area (18)

CE certify durable and Competitive SMT magazine unloader PCB tiered stacking unloader

CE certify durable and Competitive SMT magazine unloader PCB tiered stacking unloader

Videos

About more detail for the PCB destacker check the link? https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/125.html PCB destacker/PCB bare board unloader unloading bare board to replace the PCB magazine unloader machine for the PCB bar

ASCEN Technology

Hot Air Reflow Oven?

Hot Air Reflow Oven?

Videos

Surface Mount Soldering Machine Hot Air Reflow Oven​ ❙ Introduce of Reflow Soldering Oven ETA advanced reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven technology |  25 years SMT technology experience | profession

Dongguan Intercontinental Technology Co., Ltd.

Training Courses: zarrow weight to solder surface area (1)

SMT Boot Camp

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

BEST IPC Training

Events Calendar: zarrow weight to solder surface area (2)

How to Minimize Humidity Interaction with PCBAs for Robustness

Events Calendar | Tue Aug 18 00:00:00 EDT 2020 - Tue Aug 18 00:00:00 EDT 2020 | ,

How to Minimize Humidity Interaction with PCBAs for Robustness

Surface Mount Technology Association (SMTA)

Ball Grid Array Rework - How to Do It Successfully

Events Calendar | Mon May 04 00:00:00 EDT 2020 - Mon May 04 00:00:00 EDT 2020 | ,

Ball Grid Array Rework - How to Do It Successfully

Surface Mount Technology Association (SMTA)

Career Center - Jobs: zarrow weight to solder surface area (1)

Process Engineer

Career Center | Brookfield, Wisconsin USA | Engineering

ELECTRONICS MANUFACTURING ENGINEER Salary $50 to 65k Company: Our client is a manufacturer of electronic controls used in a wide variety of industrial and consumer uses. This organization has seen some very strong growth lately, sales have double

Prime Resource Associates, Inc.

Career Center - Resumes: zarrow weight to solder surface area (1)

JAMES R

Career Center | ELLENWOOD, Georgia USA | Production,Quality Control,Research and Development,Technical Support

SMT MACHINE OPERATION, FORKLIFT CERTIFY,  SUPERVISION OF MANUFACTURING AND PRODUCTION, QUALITY CONTROL TECH., AUDIO ENGINEER SKILLS,,SET-UP OF MUSICIAL THEMES AND PLAYS.

Express Newsletter: zarrow weight to solder surface area (1043)

Partner Websites: zarrow weight to solder surface area (1898)

Solder Ball Defects - Heller

Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects/

. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow. Solder ball defects are probably the most common reflow solder defect, and there are many causes of solder ball defects beyond the system that will contribute to their formation

Heller Industries Inc.


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Surface Mount Technology Association (SMTA)
Surface Mount Technology Association (SMTA)

The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.

Training Provider / Events Organizer / Association / Non-Profit

6600 City W Pkwy
Eden Prairie, MN USA

Phone: 952-920-7682