Electronics Forum | Sat Mar 08 11:04:47 EST 2003 | Joe
Mark, You've already received some good advice from the other posters. The one thing I would add is that even if you solve your printing issues on this type of part, the relative small quantity of paste may be prone to soldering problems. Ever s
Electronics Forum | Wed Nov 29 14:49:38 EST 2006 | MS
Any recommendation to reduce solder beads next to 0402, 0603 and 0805 caps and res? What about home plate vs. bow tie stencil aperture design?
Electronics Forum | Tue Dec 19 17:17:14 EST 2006 | James
Let me get this straight. You have large apertures for some reason? If this is the case you could try making the aperture like a screen, many small apertures to support the blade, rather than one large aperture that allows the blade to deflect.
Electronics Forum | Thu Feb 23 23:24:14 EST 2006 | KEN
Depends what is adjacent to the step. 1206 chips could reside closer than say a 16 mil fine pitch. Larger apertures are more forgiving to height variations than small apertures.
Electronics Forum | Mon Feb 18 12:09:17 EST 2013 | pbarton
What type of flux material does your solder paste have? I have seen difficulties when attempting to print small apertures with water washable and rosin types. Do you get a good first print and then have problems or is it the same from the start?
Electronics Forum | Sat Sep 30 12:14:32 EDT 2000 | jarnopy
Hi Maybe you have too small apertures in stencil. Good apertures size is 90% from pad. And one thing what you can try is that you cut your stencils(blades) aperture corners round (i mean like a oval). I hope that these advices can help you.
Electronics Forum | Wed Sep 01 11:09:45 EDT 2004 | burgosa
We are considering the CyberOptics SE300 for solder paste inspection at post-stencil print. Does anyone have experience with this AOI machine? How it works with small apertures like 0201's and uBGA's? Comments are welcome. Thanks
Electronics Forum | Mon Jan 09 08:25:30 EST 2006 | grantp
Hi, If the stencil was not cleaned well from the previous run, dried paste residue can cause the paste to grab in the stencil. If you have a microscope, check the small apertures for contamination. Regards, Grant
Electronics Forum | Mon Nov 12 09:13:50 EST 2007 | russ
Chunks is right, reduce center pad by 50% print the signal pads at 1:1. this will ensure you solder QFNs fine regardless of the actual part. If you are not printing then it is process capability issue and has nothing to do with QFN but rathjer small
Electronics Forum | Thu Apr 30 13:09:53 EDT 2009 | scottp
One factor I see missing is separation speed (or snap off speed). I've run experiments with different pastes where it was the biggest factor in standard deviation of print volume for small apertures.