Product name: KE - 2070 JUKI high-speed chipmounter Product number: KE - 2070 Products in detail Features: Suitable for high speed SMT chip placementmachine of small components. Not only the element corresponding to a wide rangeof laser recogniti
YAMAHA Second-Hand YV180XG Pick and Place Machine Model YV180XG Panel size L Type: Max L380 x W330 mm ∼ Min L50 x W50 mm Panel thick 0.4 ~ 3.0 mm Mounting ±0.05 mm (0.01mm control) Mounting an
Electronics Forum | Mon Feb 23 16:36:21 EST 2004 | www.smtinfo.net
Alpha Metals sells a paste developed especially for 0201's and 0.5 mm pitch BGA's. I have no idea if if does what it promises, but it might be worth to give it a try. See http://www.alphametals.com/omnixsolder/pdfs/OM_6106.PDF
Used SMT Equipment | Pick and Place/Feeders
Product name: KE - 2070 JUKI high-speed chipmounter Product number: KE - 2070 Products in detail Features: Suitable for high speed SMT chip placementmachine of small components. Not only the element corresponding to a wide rangeof laser recogniti
Used SMT Equipment | Flexible Mounters
Product Name: Samsung chip mounter CP45FV04 Product number: CP45FV04 Detailed product introduction Item: NEO CP45F/FV Visual Fly Vision (Vision+Stage) Mounting speed: Chip max speed IPC9580, 14900CPH 0.178sec/chip (1608); IC flying camera 0.75s
Industry News | 2010-04-30 18:47:15.0
SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.
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Parts & Supplies | Pick and Place/Feeders
JUKI 710 head motherboard E8621715BA0 E86227150A0 Other juki parts: E86217210A0 BGA BOARD ASM E86217290A0 TEMPERATURE SENSOR PWB ASM. E86227150A0 HEAD SUB UNIT BASE ASM. E86227290A0 LIGHT 2 PWB ASM. E86237000A0 HEAD RELAY CIRCUIT BOARD ASM E86
Parts & Supplies | Pick and Place/Feeders
JUKI 740 E8736725000 Y AXIS FL TUBE WITH VELCRO TAP Other juki parts: E8702725000 BACK LIGHT FOR LCD(SHARP) E8735725000 X AXIS FL TUBE WITH VELCRO TAP E87357250A0 X AXIS FL TUBE OVER SUMITECH G E8736725000 Y AXIS FL TUBE WITH VELCRO TAP E873672
Technical Library | 2015-08-20 15:18:38.0
Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been drastically reduced (as small as 0.5 mm in diameter) but current product design parameters have created space and access limitations that remove even the option for these test points. Many high speed signal lines have now been restricted to inner layers only. Where surface traces are still available for access, bead probe technology is an option that reduces test point space requirements as well as their effects on high speed nets and distributes mechanical loading away from BGA footprints enabling test access and reducing the risk of mechanical defects associated with the concentration of ICT spring forces under BGA devices. Building on Celestica's previous work characterizing contact resistance associated with Pr-free compatible surface finishes and process chemistry; this paper will describe experimentation to define a robust process window for the implementation of bead probe and similar bump technology that is compatible with standard Pb-free assembly processes. Test Vehicle assembly process, test methods and "Design of Experiments" will be described. Bead Probe formation and deformation under use will also be presented along with selected results.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
SMT Barcode Inkjet Printer ETA-410 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. smt barcode Inkjet Printing Machine,pcb barcode printing
ETA SMT PCB Laser Marking Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCB Laser Marking Machine,PCB Laser Marking System,PCB Aut
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-pad-size_topic3004.html
. I am currently working on a BGA footprint with .26mm nominal ball size and .5mm pitch. Is my understand correct that when ball pitch is
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
The Last Will And Testament of the BGA Void THE LAST WILL AND TESTAMENT OF THE BGA VOID David Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, and Ross Wilcoxon Rockwell Collins
