Electronics Forum | Wed Jun 20 08:14:36 EDT 2007 | pavel_murtishev
Good afternoon, You should use overprint technique if you have any problems with paste volume (PIH technology and mixed designs, for instance). Otherwise, it is useless. Overprint has to be made in such way so that paste would have an ability to flo
Electronics Forum | Fri Aug 07 07:55:30 EDT 2009 | robhs
Hi. We are planning a production run of a board that utilises the SEMTECH SLP2710P8 8-pin device (2.7 x 1.0 x 0.58mm). The part orientation on the board necessitates that the squeegee print direction approaches the stencil apertures on the long side
Electronics Forum | Sun Oct 08 00:18:05 EDT 2000 | Arturo
We are working with a 16mil TSOP Land width=0.2mm(8mil) and use: 1.Type 4 particle size solder paste. 2.Laser cut electropolished stencil: Aperture width=0.19mm (we tried lower than this but had solder insufficiency). Thickness=0.005"(130 microns)
Electronics Forum | Fri Jan 31 10:04:14 EST 2020 | emeto
Jinesh, My initial suggestion is you have too much solder past. Please try to reflow a few of these parts without solder paste. Colse aperture, put some tacky flux on this part location and give it a try. I bet you will not see any voiding.
Electronics Forum | Mon Sep 21 22:25:05 EDT 2009 | davef
What babies!!!! Sure, give it a try. * Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, available * Stencil thickness: Chips 0.006", SOIC 0.010" [print height equals 1/3 thickness] * For 0603, a
Electronics Forum | Fri Oct 09 06:32:38 EDT 2009 | davef
Here's what is on that post referred to, not sure what you need more than ... "* Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, available * Stencil thickness: Chips 0.006", SOIC 0.010" [print
Electronics Forum | Tue Nov 03 11:46:52 EST 2009 | davef
Search the finee SMTnet Archives for previous posts on the topic. Here's a clip from on of those posts that may get you started. [snip] * Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, availa
Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
Electronics Forum | Sun Jul 29 23:58:08 EDT 2001 | Frank
Hi Dave Thanks for your information. The problem that I found is paste not stick well on pads ( solder paste printing process). When the table move down (PCB saperate from stencil) some of paste stick on aperture instead pads. Solder paste : Delta
Electronics Forum | Fri Sep 11 15:58:50 EDT 2020 | majdi4
You haven't communicated what thickness of stencil you are working with ... it's interesting to know..at first, you need to reduce the amount of CAB deposited because with 1X1 stencil aperture size you are depositing an amount important CAB .. so, I
