Electronics Forum | Tue Feb 07 19:10:04 EST 2006 | GS
Hi, other effect could be the extra inter-metallic thickness that could compromise the solder joint reliability. just my 0.00001 Doblon Best regards.........GS
Electronics Forum | Sat May 27 12:50:14 EDT 2006 | GS
HI, just my 0,00001 cents Which preheat system does your wave solder has? for instance ? - IR ? - Bottom only ? - IR + Forced Air ? (bottom) - IR + Forced Air (bottom) IR top ? PCB thickness ? Appropriate preheat is important when looking to f
Electronics Forum | Fri Feb 20 10:27:37 EST 2015 | emeto
If you are in standard specs, don't even mention it. THe RoHS thing in electronics becomes more and more annoying. I haven;t seen people taking out PCBs from their electronic devices and start to chew them. So it was ok to use gas with Lead for deca
Electronics Forum | Mon Oct 15 15:29:19 EDT 2018 | emeto
You see, if you can optimize your product setup that will be the best. Back in the days, engineers used only standard values. For resistors for example I used to build boards having 100, 330, 470, 1k, 3.3k.....Sometimes that means you might end up wi
Electronics Forum | Tue Nov 07 08:01:10 EST 2006 | davef
We/ve never heard of "glass wicking failure" in regards to board fab. Boat fab, yes. Look here: http://www.boatdesign.net/forums/showthread.php?t=13321 Barrel cracking appears after thermal stress during soldering, because epoxy expands in the "z"
Electronics Forum | Wed Feb 27 14:07:25 EST 2002 | Stefan
In order to kiss off the components with an air blow, there are two times to consider: 1. reaction time of the solenoid ( to shut off the vacuum and turn on the air ), 5-10 ms 2. time required to fill up an air hose, which leads to the nozzle. Assumi
Electronics Forum | Tue Jul 02 09:29:08 EDT 2002 | dason_c
Ian, First, I baked the parts at 125C for 48 hours and check the weight Second, I soaked the parts above 30C and 60% for 96 hours and check the weight Calculate the weight gain, suppose only moisture add to the parts during soaking, say a Third, dry
Electronics Forum | Mon Jul 21 09:34:54 EDT 2003 | caldon
A machine for serious concideration MRSI 175uf Features: -High-throughput Underfill -Parallel Processing Conveyor Lanes -Linear Positive Displacement Pump -Total Process Thermal Control -Intuitive Graphical User Interface - Windows NT -Advanced
Electronics Forum | Tue Apr 13 14:49:15 EDT 2010 | davef
90%) from the sample, and the bake time and temperature specified herein are minimums. To improve test accuracy, or to prevent heat damage, other bake parameters may be AABUS. 2 Applicable Documents IPC-QL-653 Certification of Facilities that Inspect
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