Industry Directory: 0.4 bga (1)

Lim Manufacturing (Pte) Ltd

Industry Directory | Manufacturer

Contract Electronics Manufacturers also providing completely integrated warehousing and logistics services to provide one stop total fulfilment services

New SMT Equipment: 0.4 bga (20)

BGA Reballing Services

BGA Reballing Services

New Equipment | Rework & Repair Equipment

Visit PSI's main BGA Reballing Services page for more information. PSI has over 20 years experience reballing BGA devices of every size, pitch, and package style: micro-BGAs Alloy conversion from Sn/Pb to Pb-free, or Pb-free to Sn/Pb Reclaim a

Process Sciences, Inc.

BGA UC / BGA ST Series BGA Drill Bits

BGA UC / BGA ST Series BGA Drill Bits

New Equipment | Depaneling

BGA UC / BGA ST Series drills are developed for BGA boards and focus on improving hole registration accuracy and inner hole wall quality.  For BGA UC/ST - series Diameter: ø0.05 ~ ø0.25mm Diameter (D) Flute Length (L)

Plastlist Group

Electronics Forum: 0.4 bga (35)

0.4 mm Pitch BGA stencil design

Electronics Forum | Mon Nov 01 10:29:13 EDT 2010 | scottp

I've searched the archives and maybe my search skills aren't up to snuff but I couldn't find much. I'm curious what people are doing for 0.4 mm pitch BGAs, assuming a type 4 paste. Pad diameter? SMD or NSMD? Stencil thickness? Aperture diameter? Us

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Tue Nov 12 00:49:37 EST 2019 | myke03o

I am optimizing a stencil opening for BGA with 0.4mm pitch and pad diameter of 0.2mm. Can anyone advice of stencil thickness and stencil opening I can use in order to have a good paste release. Thanks for all your answers.

Used SMT Equipment: 0.4 bga (43)

Samsung multi-function SM421 chip mounter

Samsung multi-function SM421 chip mounter

Used SMT Equipment | Flexible Mounters

Product Name: Samsung multi-function SM421 chip mounter Product number: SM421 Detailed product introduction Samsung multi function SM421 chip mounter Mounting speed: 21K CPH /QFP (IPC9850) 5.5K CPH Chip (IPC9850) The corresponding components: Ma

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Samsung original multi-function SM421 chip mounter

Samsung original multi-function SM421 chip mounter

Used SMT Equipment | SMT Equipment

Product Name: Samsung multi-function SM421 chip mounter Product number: SM421 Detailed product introduction Samsung multi function SM421 chip mounter Mounting speed: 21K CPH /QFP (IPC9850) 5.5K CPH Chip (IPC9850) The corresponding components: Ma

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: 0.4 bga (26)

SMTA China Presents Awards at SMTA China East 2010 Conference/Nepcon China 2010

Industry News | 2010-04-30 18:47:15.0

SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.

Surface Mount Technology Association (SMTA)

The Design Principles of Stencil Apertures

Industry News | 2018-10-18 10:24:05.0

The Design Principles of Stencil Apertures

Flason Electronic Co.,limited

Parts & Supplies: 0.4 bga (279)

Yamaha YV100X YAMAHA multi-functional chip mounter

Yamaha YV100X YAMAHA multi-functional chip mounter

Parts & Supplies | Assembly Accessories

Product name: YV100X YAMAHA multi-functional chip mounter Product number: YV100X Products in detail YAMAHA multi-function placement machineYAMAHA YV100X  substrate size: ATS20 (end to put) W -AT assembly: L460 * W250 (Max)/L50 * W50 (Min)sub

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Juki  Spare Parts JUKI 750 760 EJECTOR E3066700000 PISCO VBH07-46

Juki Spare Parts JUKI 750 760 EJECTOR E3066700000 PISCO VBH07-46

Parts & Supplies | SMT Equipment

SMT SPARE PARTS JUKI 750 760 EJECTOR E3066700000 PISCO VBH07-46 JUKI Nozzle Specifications: Brand Name JUKI EJECTOR Part Number E3066700000 Model Number VBH07-46 Ensure Tested buy juki Guarantee 1 month usage for machine JUKI 750 760 Sel

KingFei SMT Tech

Technical Library: 0.4 bga (1)

Assembly and Reliability of 1704 I/O FCBGA and FPBGAs

Technical Library | 2013-03-14 17:19:28.0

Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.

Jet Propulsion Laboratory

Videos: 0.4 bga (12)

Yamaha YV100XGP / Y18680

Videos

1. Manufacturing location of yamaha medium-speed placement machine  2. YV100XG factory year period 2000-2006; YV100XGP general year: 2005-2007 (now discontinued; only second-hand equipment is on sale in the market) 3. This model is a medium-

Qinyi Electronics Co.,Ltd

Yamaha YV100XGP / Y17942

Videos

1. Manufacturing location of yamaha medium-speed placement machine  2. YV100XG factory year period 2000-2006; YV100XGP general year: 2005-2007 (now discontinued; only second-hand equipment is on sale in the market) 3. This model is a medium-

Qinyi Electronics Co.,Ltd

Events Calendar: 0.4 bga (1)

India Chapter Webinar: PCBA Process Qualifications

Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,

India Chapter Webinar: PCBA Process Qualifications

Surface Mount Technology Association (SMTA)

Career Center - Resumes: 0.4 bga (2)

Project Manager - Electronics Products

Career Center | , | Engineering,Production

Project Management, SMT Process Engineering

PCBA ENGINEERING MANAGER

Career Center | , | Engineering,Production,Quality Control

SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS

Express Newsletter: 0.4 bga (463)

Partner Websites: 0.4 bga (301)

2AGKNX005303 FUJI NXT III H24 Head 0.4mm Pick And Place Nozzle

| https://www.feedersupplier.com/sale-13119120-2agknx005303-fuji-nxt-iii-h24-head-0-4mm-pick-and-place-nozzle.html

0.4 Fuji Nozzle Part Number: 2AGKNX005303 Brand: FUJI Usage: For FUJI NXT Machine Condition: New Quality: 100% Tested Package: Carton Packaging High Light: NXT III H24

Beamworks Spark 400

1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_beamworks_spark400.html

For accurate and controlled paste deposit Dispensing Capability Line dispensing: down to 0.4 mm (0.016”) pitch Dot dispensing: down to 0.3 mm (0.012”) in diameter Capability to dispense solder paste or epoxy dots and lines

1st Place Machinery Inc.


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