Demonstrates installation of a BGA component using the AT-707 BGA Rework Station. Features include split vision optics, software process control, and lead free reflow capable.
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish SMTnet Express December 13, 2012, Subscribers: 26067, Members: Companies: 9068, Users: 34058 Influence of Pd Thickness on Micro Void Formation of Solder
Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. The purpose
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
. It is a single layer board with the board thickness of 62 mils (1.57 mm) and the board size of 3.875 x 5.375 inch2. The board material is FR-4. Figure1
| https://www.smtfactory.com/I-C-T-SS430-Off-line-Selective-Wave-Soldering-Machine-China-Supplier-pd41861093.html
Capacity 12Kg Max PCB Size 500*500mm Max PCB Size 60mm PCB Thickness 0.5-6.0mm PCB Weight <20Kg Operating System Windows10 Power Supply 220VAC±10%, 50/60HZ Dimension L1400*W2580*H1722mm Weight Approx:700kg * I.C.T keeps working on quality and performance
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
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