Industry Directory: 0.5 mm thick ness board reflow (3)

Sierra Circuits Inc.

Industry Directory | Manufacturer

A printed circuit board manufacturer producing high quality prototype printed circuit boards.

Rommtech-3S

Industry Directory | Manufacturer

Rommtech-3S is your partner for reliable and cost effective contract manufacturing!have more than 15 years experience in the production of electronic and electromechanical devices � security products, radiators; cash registers manufacturing; igniters

New SMT Equipment: 0.5 mm thick ness board reflow (3345)

Automatic solder paste printer GKg G9+

Automatic solder paste printer GKg G9+

New Equipment | Assembly Services

G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function

KingFei SMT Tech

JUKI Used KE2070L High Speed Chip Shooter SMT Machine

JUKI Used KE2070L High Speed Chip Shooter SMT Machine

New Equipment | Pick & Place

JUKI KE2070L High Speed Chip Shooter SMT Machine MC Model KE-2070 Board size M size (330×250mm) ○ L size (410×360mm) ○ L-Wide size(510×

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Electronics Forum: 0.5 mm thick ness board reflow (121)

672 PBGA on PC Card .015 thick pcb

Electronics Forum | Tue Oct 09 20:27:13 EDT 2001 | davef

That�s a 672 BALL BGA, bud!!! It�s a BIG Mutha!!! [I know. I know. For some reason suppliers call balls "pins".] Let�s focus on: * Clarifying the units on your PCB and aluminum plate thickness measurements. * Describing your use of the aluminum pl

672 PBGA on PC Card .015 thick pcb

Electronics Forum | Thu Oct 11 22:25:50 EDT 2001 | davef

Bruce I�m with yall. Designers and fabricators say �pins�. You say: * BGA pins are 1mm [0.039�] pitch. * BGA pads are 0.4mm [0.0157�] diameter. * BGA pins are 0.6 mm [0.024�] side-to-side. * Board thickness is ~0.4 mm [0.015�] First, as you can

Used SMT Equipment: 0.5 mm thick ness board reflow (37)

MPM Momentum+ Printer

MPM Momentum+ Printer

Used SMT Equipment | Screen Printers

MPM Momentum+ Printer Substrate treatment                                                       Maximum plate size(XxY) 609.6 mm x 508 mm(24”x 20”) Segmented mode-Momentum Elite  457 mm x 508 mm(18"x20") Minimum Plate Size (XxY)

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Samsung original high speed SM411 chip mounter

Samsung original high speed SM411 chip mounter

Used SMT Equipment | SMT Equipment

Product Name: Samsung high speed SM411 chip mounter Product number: SM411 Detailed product introduction Samsung high speed SM411 chip mounter parameters type: SM411 On the way: In - flight vision Number: 6 - axis *2 axis platform mount speed:

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: 0.5 mm thick ness board reflow (56)

Three Sun Multilayer PCB Accommodates 0.5mm(�) Holes

Industry News | 2003-05-19 10:06:43.0

The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.

SMTnet

What is the LED Panel SMT Production Process?

Industry News | 2022-10-12 07:22:35.0

I.C.T As an SMT Factory Solution Partner, Mainly Provide Full SMT Line Machine. Including SMT Pick and Place Machine, PCB Reflow Oven, SMT Stencil Printer, PCB Wave Soldering Machine, PCB Handing Machine and SMT Peripheral Equipment for Global Customers.

Dongguan Intercontinental Technology Co., Ltd.

Parts & Supplies: 0.5 mm thick ness board reflow (19)

Separation Technologies PCB Separator PS2000

Separation Technologies PCB Separator PS2000

Parts & Supplies | SMT Equipment

PCB Separator machine PS2000 Parameters: Max. Separation Width 200 mm PCB thickness 0.5~3 mm Feed rate 200,300,400,500mm/s Blade material Sweden HSS SKH-7 Size 340*340*420 (L*W*H) Power AC220V, 50HZ, 30W Weight 30 kg Feature: The accurate

KingFei SMT Tech

Separation Technologies PCB Cutter / Separator machine

Separation Technologies PCB Cutter / Separator machine

Parts & Supplies | SMT Equipment

PCB Cutter / Separator machine Specification: Max. Separation Length:300 mm PCB thickness:0.5~3 mm Feed rate:80,120,200,300 mm/s Blade material: HSS steel Weight:27 kg Feature: The accurately adjustable space between the blades is applicabl

KingFei SMT Tech

Technical Library: 0.5 mm thick ness board reflow (1)

Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in Sn-Pb Assembly Process

Technical Library | 2020-10-27 02:07:31.0

For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.

Sanmina-SCI

Videos: 0.5 mm thick ness board reflow (198)

CE certified PCB stack loader manufacturer automatic loading PCB board

CE certified PCB stack loader manufacturer automatic loading PCB board

Videos

Check more detail for PCB stacker: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/97.html PCB stacker and bare board PCB loader use for automatic PCB bare board production line that can save more labor cost and without the magazin

ASCEN Technology

automatic SMT PCB stacker push up stacker from ASCEN team

automatic SMT PCB stacker push up stacker from ASCEN team

Videos

Check more detail for PCB stacker: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/97.html PCB stacker and bare board PCB loader use for automatic PCB bare board production line that can save more labor cost and without the magazin

ASCEN Technology

Career Center - Resumes: 0.5 mm thick ness board reflow (1)

Sales Manager

Career Center | Shen Zhen, China | Management,Sales/Marketing

Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe

Express Newsletter: 0.5 mm thick ness board reflow (1032)

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Effect of Reflow Profile on SnPb and SnAgCu Solder

Partner Websites: 0.5 mm thick ness board reflow (63)

Original Screen Printing Machine Parts Silm Reflow Oven Reflow Profiler KIC 2000 12CH

KingFei SMT Tech | http://www.smtspare-parts.com/sale-11936479-original-screen-printing-machine-parts-silm-reflow-oven-reflow-profiler-kic-2000-12ch.html

: Reflow Profiler Model: KIC 2000 Brand: KIC Accuracy: +/-0.5 Deg.C Temperature Range: Can Up To 350-400 Deg.C Size: 320*86*26(mm) High Light: screen printer parts , dek spare parts Original silm reflow oven reflow profiler KIC 2000 12CH

KingFei SMT Tech

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

. The printed circuit board (PCB) test vehicle is 2.36 mm (93 mils) thick, with a 6 layer construction and 16 sites each for the 192CABGA and 84CTBGA

Heller 公司


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