Automatic Pick and Place TP50V Product Description: TP series is a fully automatic vision SMT pick and place machine, it can mount a variety of components through the vacuum nozzle can be mounted .it is the most cost effective automatic placement e
Automatic Pick and Place TP50V Product Description: TP series is a fully automatic vision SMT pick and place machine, it can mount a variety of components through the vacuum nozzle can be mounted .it is the most cost effective automatic placement e
Electronics Forum | Fri May 06 08:47:05 EDT 2016 | davef
You're correct. This design will have a record amount of 0402 rework for tombstoning and misalignments. Suggest that the pads on each end of all components be the same size in order to balance wetting forces during reflow.
Electronics Forum | Fri May 06 06:51:55 EDT 2016 | abhilash4788
Hi All, One of my customer has provided a pcb design having common pad for 0402 and 1206 package(i.e 3 pads in the gerber, pad1,pad2 belongs to 1206 package and pad2,pad3 belongs to 0402 package) Will this create any solderability issue. Is anyone e
Used SMT Equipment | Chipshooters / Chip Mounters
Model :FX-2/FX-2C Placement speed：Chips:40000CPH*2(0.09sec/chip) Component mount range:0402 chips ~33.5mm Station:80 Power supply:3-phase AC200~415V 4KVA/12KVA Size:1880*1731*1490mm Weight:2100kg
Used SMT Equipment | SMT Equipment
Model :FX-3R Pick and Place Machine Placement speed：Chips:90000CPH(0.04sec/chip) Component mount range:0402 chips ~33.5mm Station:160 Power supply:200-415(V) Size:2,650x1, 650x1, 530mm Weight:3,100kg
Industry News | 2018-10-18 08:00:40.0
SMT solder joint quality and appearance inspection process
Industry News | 2018-10-18 08:01:00.0
SMT solder joint quality and appearance inspection process
Parts & Supplies | Pick and Place/Feeders
KE-2060 can place a wide range of components from 0603 and ICs, to odd-form, all at a high rate of speed. 12,500CPH?chip (laser centering/effective tact) 1,850CPH: IC (vision centering/effective tact), 3,400CPH with MNVC option. One multi-nozzle
Parts & Supplies | Pick and Place/Feeders
Part Number Description Reel Size Machine FUJI CP-6 and CP-7 Feeders AWCH-6000 8mm x 2mm paper for 0201C 7" CP-6 & CP-7 AWCA-6600 8mm x 2mm paper for 0402C & 0402R 7" CP-6 & CP-7 AWCA-6700 8mm x 2mm paper for 0402R .3mm 7" CP-6 & CP-7 AWCA-
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
JUKI RX-6R SMD Pick and Place Machine ❙ Introduce of JUKI RX-6R High Speed Compact Modular pick and place machine, JUKI RX-6R SMT placement, JUKI PCB Chip Shooter, Speed and Flexibility for High Quality Production of any PC
FUJI M6 III High Speed Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place ma
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Lewis & Clark | https://www.lewis-clark.com/product/samsung-sm320-pick-and-place/
: Single Gantry 6 Spindle Head Min component size 0402 Max PCB size 18” x 18” Six Laser Flying Vision and Stage Vision systems One Upward Looking Fixed Camera Vision System for IC Placement rates
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_europlacer_pick_and_place.html
Europlace Pick and Place Europlacer Placement Machine Serial Number: 505 Model Number: Progress 6 Min/Max Board Size: 50 x 50 x 0.5 mm - 500 x 460 x
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