Electronics Forum | Thu Jun 02 17:24:19 EDT 2005 | PWH
Could also be a ground plane under one of the terminations of the cap causing heat sink troubles during reflow. One pad liquifies/solidifies before the other. Don't know a good solution for this outside of reworking them.
Electronics Forum | Thu Jan 15 03:20:59 EST 2009 | sachu_70
Hi Andrzej, I guess you mean peelable solder resist. Good idea to try during R&D, but certainly not a solution on production floor. Also, few constraints to be considered such as presence of entrapped air between component and solder resist, the natu
Electronics Forum | Tue Dec 26 12:35:09 EST 2000 | Dave F
Your English is fine. Your assessment that corrosion on a portion of the metalization on the end of a component is causing the tombstoning is reasonable. We've seen that before. Corroded components received from a supplier is not acceptable as an
Electronics Forum | Mon Sep 18 11:55:35 EDT 2000 | Ricardo Fuentes
Hi! cold someone advise me about the minimum gap allowable in between 0404 parts. The minimum distance is because of the behavior on reflow, the re-work difficulty or anything else. Thanks
Electronics Forum | Fri May 06 08:47:05 EDT 2016 | davef
You're correct. This design will have a record amount of 0402 rework for tombstoning and misalignments. Suggest that the pads on each end of all components be the same size in order to balance wetting forces during reflow.
Electronics Forum | Thu Jan 04 15:39:07 EST 2007 | dyoungquist
While the 85% yield on a per board basis seems low, we are actually running over 99% yield on a per solder joint basis as there are about 17,700 joints per panel. On average, 9 out of 63 boards in the panel need rework. Rework issues include missin
Electronics Forum | Thu Oct 20 16:11:08 EDT 2022 | cyber_wolf
I have no experience with the MY100. Personally, I'm not a fan of platforms where the PCB is not stationary. Mechanical feeders typically require more maintenance than electronic. Yamaha is one of the few I haven't worked with. It is my understan
Electronics Forum | Tue Jan 02 16:49:14 EST 2007 | dyoungquist
I am looking for data on the yield of printed circuit board assemblies so that I can judge if our SMT line is performing up to typical industry standards. Following I will describe the details of the assembly and what our yield has been. Each board
Electronics Forum | Thu May 12 00:18:55 EDT 2016 | darby
Sorry for delay - been flat out. Sr - I understand what you are saying. My concern is that combined with the head offsets and variations in pick points (i.e. having to teach feeder positions for very slight amounts like 0.05mm)then you cycle times wi
Electronics Forum | Thu Jan 29 07:44:12 EST 2015 | mskler
Dear All, What is the best temprature for the rework of the leadfree components for 0402, 0603, and bigger components?
